{"title":"改进锥形壳细胞超材料平板扬声器的平坦频率响应。抛光工艺。11/2025)","authors":"Hyunhee Kwon, Dong Hwi Kim, Wan-Ho Cho, Miso Kim","doi":"10.1002/admt.202570057","DOIUrl":null,"url":null,"abstract":"<p><b>Conical Shellular Metamaterials</b></p><p>In article number 2401910, Miso Kim and co-workers introduce a high-stiffness, low-density conical shellular metamaterial (CSM) to realize a piezoelectric flat panel loudspeaker with flat frequency responses. Integrating CSM into the diaphragm reduces peak-dip deviation, creating a smoother and more comfortable sound experience. This approach enhances spatial efficiency and overcomes design limitations, thereby expanding the usability of flat panel loudspeakers.\n\n <figure>\n <div><picture>\n <source></source></picture><p></p>\n </div>\n </figure></p>","PeriodicalId":7292,"journal":{"name":"Advanced Materials Technologies","volume":"10 11","pages":""},"PeriodicalIF":6.4000,"publicationDate":"2025-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/admt.202570057","citationCount":"0","resultStr":"{\"title\":\"Improved Flat Frequency Response of Conical Shellular Metamaterial-Enabled Flat Panel Loudspeaker (Adv. Mater. Technol. 11/2025)\",\"authors\":\"Hyunhee Kwon, Dong Hwi Kim, Wan-Ho Cho, Miso Kim\",\"doi\":\"10.1002/admt.202570057\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><b>Conical Shellular Metamaterials</b></p><p>In article number 2401910, Miso Kim and co-workers introduce a high-stiffness, low-density conical shellular metamaterial (CSM) to realize a piezoelectric flat panel loudspeaker with flat frequency responses. Integrating CSM into the diaphragm reduces peak-dip deviation, creating a smoother and more comfortable sound experience. This approach enhances spatial efficiency and overcomes design limitations, thereby expanding the usability of flat panel loudspeakers.\\n\\n <figure>\\n <div><picture>\\n <source></source></picture><p></p>\\n </div>\\n </figure></p>\",\"PeriodicalId\":7292,\"journal\":{\"name\":\"Advanced Materials Technologies\",\"volume\":\"10 11\",\"pages\":\"\"},\"PeriodicalIF\":6.4000,\"publicationDate\":\"2025-06-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://onlinelibrary.wiley.com/doi/epdf/10.1002/admt.202570057\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Materials Technologies\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://onlinelibrary.wiley.com/doi/10.1002/admt.202570057\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Materials Technologies","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/admt.202570057","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Improved Flat Frequency Response of Conical Shellular Metamaterial-Enabled Flat Panel Loudspeaker (Adv. Mater. Technol. 11/2025)
Conical Shellular Metamaterials
In article number 2401910, Miso Kim and co-workers introduce a high-stiffness, low-density conical shellular metamaterial (CSM) to realize a piezoelectric flat panel loudspeaker with flat frequency responses. Integrating CSM into the diaphragm reduces peak-dip deviation, creating a smoother and more comfortable sound experience. This approach enhances spatial efficiency and overcomes design limitations, thereby expanding the usability of flat panel loudspeakers.
期刊介绍:
Advanced Materials Technologies Advanced Materials Technologies is the new home for all technology-related materials applications research, with particular focus on advanced device design, fabrication and integration, as well as new technologies based on novel materials. It bridges the gap between fundamental laboratory research and industry.