基于双反相模式的低轮廓宽带一致辐射方向图贴片天线

IF 3.7 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Li Zuo;Zhixi Liang;Yunliang Long
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引用次数: 0

摘要

提出了一种基于双反相模式的低轮廓、辐射方向图一致的宽带微带贴片天线。首先,引入一对窄槽和差分馈电方案来激发具有双共振的反相模式。通过电场分布和磁流分布分析了其机理。由于同相磁流,反相TM20模式具有宽边模式。其次,蚀刻一对宽槽以消除由反相TM22模式产生的辐射零,并抑制不需要的TM12模式。再次,加载4个短引脚改善阻抗匹配,实现双模组合,进一步提高带宽。此外,还研究了天线演化过程中带宽的变化。测量结果表明,在低轮廓为0.02λ0的情况下,带宽可显著提高到45.7% [(5.9 ~ 9.4)GHz]。提出的天线以9.48 dBi的峰值增益实现了一致的宽侧辐射方向图。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Low-Profile Wideband Patch Antenna With Consistent Radiation Patterns Based on Dual Antiphase Modes
A low-profile wideband microstrip patch antenna (MPA) with consistent radiation patterns is proposed based on dual antiphase modes. First, a pair of narrow slots and a differential-fed scheme are introduced to excite antiphase modes with dual resonances. The mechanism is analyzed by the electric fields and magnetic current distributions. The antiphase TM20 mode has broadside patterns due to in-phase magnetic currents. Second, a pair of wide slots is etched to eliminate the radiation null produced by the antiphase TM22 mode and to suppress the unwanted TM12 mode. Thirdly, four shorting pins are loaded to improve impedance matching and to achieve a dual-mode combination, which further enhances the bandwidth. Besides, the bandwidth variation of antenna evolution is investigated. Measured results show that the bandwidth can be significantly enhanced to 45.7% [(5.9 to 9.4) GHz] with a low profile of 0.02λ0. The proposed antenna achieves consistent broadside radiation patterns with a peak gain of 9.48 dBi.
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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