{"title":"熔融PbO-B2O3-Bi2O3-CuO玻璃对430ss的润湿","authors":"Ran Sui , Qiaoli Lin , Zixu Zuo","doi":"10.1016/j.jallcom.2025.181333","DOIUrl":null,"url":null,"abstract":"<div><div>In this work, a low melting point glass solder was prepared by using the dust waste with lead content of about 30 wt% from a metallurgical plant through formula optimization, aiming at recycling the waste and reducing environmental pollution. The glass solder is mainly composed of PbO-<sub>2</sub>°<sub>3</sub>-B<sub>2</sub>°<sub>3</sub>-CuO, which has a glass transition temperature of 286.3℃ (T<sub>g</sub>), a crystallization temperature of 428.4℃ (T<sub>c</sub>), a complete fusion temperature of 490.3℃ (T<sub>m</sub>), a thermal expansion coefficient of 1.10×10–5 /℃ (from room temperature to T<sub>g</sub>), and surface tension <sub>lv</sub> = 217.58 – 0.78(T – T<sub>m</sub>) mN/m (from T<sub>m</sub> to 530 ℃). In the experiment, the wettability and spreading dynamics of 430ss by molten glass melt were studied by traditional and improved sessile drop method. The results show that the good wettability, and the contact angle can be as low as 4.7°, and the spreading process is mainly determined by the interface reaction and the viscosity of melt. In addition, the thermal expansion coefficient of glass solder is close to that of 430ss, which is suitable for sealing applications. This work provides basic physical property data for glass solders suitable for 430ss sealing, and provides experience for the development of new glass solders.</div></div>","PeriodicalId":344,"journal":{"name":"Journal of Alloys and Compounds","volume":"1033 ","pages":"Article 181333"},"PeriodicalIF":6.3000,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wetting of 430ss by molten PbO-B2O3-Bi2O3-CuO glass\",\"authors\":\"Ran Sui , Qiaoli Lin , Zixu Zuo\",\"doi\":\"10.1016/j.jallcom.2025.181333\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>In this work, a low melting point glass solder was prepared by using the dust waste with lead content of about 30 wt% from a metallurgical plant through formula optimization, aiming at recycling the waste and reducing environmental pollution. The glass solder is mainly composed of PbO-<sub>2</sub>°<sub>3</sub>-B<sub>2</sub>°<sub>3</sub>-CuO, which has a glass transition temperature of 286.3℃ (T<sub>g</sub>), a crystallization temperature of 428.4℃ (T<sub>c</sub>), a complete fusion temperature of 490.3℃ (T<sub>m</sub>), a thermal expansion coefficient of 1.10×10–5 /℃ (from room temperature to T<sub>g</sub>), and surface tension <sub>lv</sub> = 217.58 – 0.78(T – T<sub>m</sub>) mN/m (from T<sub>m</sub> to 530 ℃). In the experiment, the wettability and spreading dynamics of 430ss by molten glass melt were studied by traditional and improved sessile drop method. The results show that the good wettability, and the contact angle can be as low as 4.7°, and the spreading process is mainly determined by the interface reaction and the viscosity of melt. In addition, the thermal expansion coefficient of glass solder is close to that of 430ss, which is suitable for sealing applications. This work provides basic physical property data for glass solders suitable for 430ss sealing, and provides experience for the development of new glass solders.</div></div>\",\"PeriodicalId\":344,\"journal\":{\"name\":\"Journal of Alloys and Compounds\",\"volume\":\"1033 \",\"pages\":\"Article 181333\"},\"PeriodicalIF\":6.3000,\"publicationDate\":\"2025-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Alloys and Compounds\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0925838825028944\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0925838825028944","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Wetting of 430ss by molten PbO-B2O3-Bi2O3-CuO glass
In this work, a low melting point glass solder was prepared by using the dust waste with lead content of about 30 wt% from a metallurgical plant through formula optimization, aiming at recycling the waste and reducing environmental pollution. The glass solder is mainly composed of PbO-2°3-B2°3-CuO, which has a glass transition temperature of 286.3℃ (Tg), a crystallization temperature of 428.4℃ (Tc), a complete fusion temperature of 490.3℃ (Tm), a thermal expansion coefficient of 1.10×10–5 /℃ (from room temperature to Tg), and surface tension lv = 217.58 – 0.78(T – Tm) mN/m (from Tm to 530 ℃). In the experiment, the wettability and spreading dynamics of 430ss by molten glass melt were studied by traditional and improved sessile drop method. The results show that the good wettability, and the contact angle can be as low as 4.7°, and the spreading process is mainly determined by the interface reaction and the viscosity of melt. In addition, the thermal expansion coefficient of glass solder is close to that of 430ss, which is suitable for sealing applications. This work provides basic physical property data for glass solders suitable for 430ss sealing, and provides experience for the development of new glass solders.
期刊介绍:
The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.