Thermally conductive and shape-stable PEG/Cu@rGO-CMF composite phase change material via 3D porous skeleton for solar-thermal energy storage and electronics cooling

Phase change materials (PCMs), possessing exceptional thermal storage properties and exhibiting stable phase change temperatures, hold considerable promise for the sustainable thermal regulation for electronic equipment. However, conventional PCM is associated with inherent drawbacks such as the risk of fluid leakage, limited formability and low thermal conductivity. These limitations have significantly impeded its further technological advancements and widespread applicability. Herein, this paper presents a straightforward and efficient approach for fabricating composite phase change material (CPCM) with shape stability and enhanced thermal conductivity. Polyethylene glycol (PEG)/Cu@rGO-CMF was fabricated via a one-step high-temperature reduction method combined with vacuum impregnation, utilizing carbonized melamine foam (CMF) as the porous carrier and Cu particles with reduced graphene oxide (rGO) as the modified materials. Experimental findings reveal that the three-dimensional high-density thermally conductive network constructed by Cu@rGO-CMF remarkably improves the thermal conductivity of CPCM with a 87.5 % enhancement. The porous carrier achieves efficient encapsulation of PEG (loading ratio > 97.8 %) through physical interactions such as capillary action and hydrogen bonding, and confers excellent shape stability and thermal storage properties (149.8–153.2 J/g) to CPCM. In addition, the CPCM exhibits superior cyclic thermal stability, photothermal conversion efficiency (80.3 %–85.8 %) and thermal management capabilities, thereby offering a concise and effective solution for photovoltaic energy conservation and heat dissipation control in advanced electronics systems.