Fabrication of multifunctional wearable interconnect E-textile platform using direct ink writing (DIW) 3D printing

Textiles, integral to human life for centuries, have recently garnered significant interest for electronic applications. However, traditional fabrication methods for electronic textiles (E-textiles) are typically complex. This research introduces an innovative approach utilizing Direct Ink Writing (DIW) 3D printing to develop multifunctional wearable electronic textiles. Specifically, the study addresses the creation of a strain sensor and an interconnect electrode directly printed onto textile substrates. The DIW-printed strain sensor exhibited excellent sensitivity, achieving a gauge factor of 11.07, significant linearity (R² ~ 0.99), and consistent performance under repeated mechanical stress. Additionally, the interconnect electrode was engineered to selectively bridge textile layers through controlled impregnation, resulting in stable resistance values (0.2–0.4Ω) under strain and pressure. These components were effectively incorporated into smart garments, facial masks, and multilayered gloves, enabling precise real-time monitoring of body movements, respiration, and tactile recognition, thus significantly advancing functionality and versatility in wearable electronics.