Hao Li, Qiang Liu, Yiming Du, Yanyan Liu, Wei Zhang, Xingyou Tian, Hua Wang
{"title":"可拉伸耐低温柔性环氧树脂固化剂的制备及性能研究","authors":"Hao Li, Qiang Liu, Yiming Du, Yanyan Liu, Wei Zhang, Xingyou Tian, Hua Wang","doi":"10.1039/d5py00254k","DOIUrl":null,"url":null,"abstract":"Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced. A silane-modified curing agent (DETA-Si) and a flexible-chain-engineered curing agent (NBO<small><sub><em>n</em></sub></small>) were synthesized to achieve unprecedented mechanical–electrical–thermal synergies. The DETA-Si/EP composite demonstrates a record-breaking elongation at break of 125% (22× improvement over unmodified systems) while maintaining ultralow dielectric loss (tan <em>δ</em> < 0.04) and thermal stability (<em>T</em><small><sub>d</sub></small> = 236 °C). The NBO<small><sub><em>n</em></sub></small> series, incorporating rigid benzene rings and tunable aliphatic chains, exhibits exceptional cryogenic resilience: 18% elongation at 298 K with >50% ductility retention after 24-hour immersion in liquid nitrogen (77 K). Conductive composites cured with EP/NBO<small><sub>10</sub></small> show stable resistance (±5%) under 30-day cryogenic exposure. Free volume engineering, validated <em>via</em> WLF modeling, underpins the enhanced low-temperature performance. These advancements establish a paradigm for epoxy resins in flexible electronics operating under extreme conditions, such as flexible sensors and polar climate devices.","PeriodicalId":100,"journal":{"name":"Polymer Chemistry","volume":"149 1","pages":""},"PeriodicalIF":4.1000,"publicationDate":"2025-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Preparation and properties of stretchable low temperature resistant flexible epoxy resin curing agent\",\"authors\":\"Hao Li, Qiang Liu, Yiming Du, Yanyan Liu, Wei Zhang, Xingyou Tian, Hua Wang\",\"doi\":\"10.1039/d5py00254k\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced. A silane-modified curing agent (DETA-Si) and a flexible-chain-engineered curing agent (NBO<small><sub><em>n</em></sub></small>) were synthesized to achieve unprecedented mechanical–electrical–thermal synergies. The DETA-Si/EP composite demonstrates a record-breaking elongation at break of 125% (22× improvement over unmodified systems) while maintaining ultralow dielectric loss (tan <em>δ</em> < 0.04) and thermal stability (<em>T</em><small><sub>d</sub></small> = 236 °C). The NBO<small><sub><em>n</em></sub></small> series, incorporating rigid benzene rings and tunable aliphatic chains, exhibits exceptional cryogenic resilience: 18% elongation at 298 K with >50% ductility retention after 24-hour immersion in liquid nitrogen (77 K). Conductive composites cured with EP/NBO<small><sub>10</sub></small> show stable resistance (±5%) under 30-day cryogenic exposure. Free volume engineering, validated <em>via</em> WLF modeling, underpins the enhanced low-temperature performance. These advancements establish a paradigm for epoxy resins in flexible electronics operating under extreme conditions, such as flexible sensors and polar climate devices.\",\"PeriodicalId\":100,\"journal\":{\"name\":\"Polymer Chemistry\",\"volume\":\"149 1\",\"pages\":\"\"},\"PeriodicalIF\":4.1000,\"publicationDate\":\"2025-05-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polymer Chemistry\",\"FirstCategoryId\":\"92\",\"ListUrlMain\":\"https://doi.org/10.1039/d5py00254k\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"POLYMER SCIENCE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer Chemistry","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1039/d5py00254k","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
Preparation and properties of stretchable low temperature resistant flexible epoxy resin curing agent
Two innovative molecular design strategies for epoxy curing agents to address the inherent brittleness and cryogenic limitations of conventional epoxy systems are introduced. A silane-modified curing agent (DETA-Si) and a flexible-chain-engineered curing agent (NBOn) were synthesized to achieve unprecedented mechanical–electrical–thermal synergies. The DETA-Si/EP composite demonstrates a record-breaking elongation at break of 125% (22× improvement over unmodified systems) while maintaining ultralow dielectric loss (tan δ < 0.04) and thermal stability (Td = 236 °C). The NBOn series, incorporating rigid benzene rings and tunable aliphatic chains, exhibits exceptional cryogenic resilience: 18% elongation at 298 K with >50% ductility retention after 24-hour immersion in liquid nitrogen (77 K). Conductive composites cured with EP/NBO10 show stable resistance (±5%) under 30-day cryogenic exposure. Free volume engineering, validated via WLF modeling, underpins the enhanced low-temperature performance. These advancements establish a paradigm for epoxy resins in flexible electronics operating under extreme conditions, such as flexible sensors and polar climate devices.
期刊介绍:
Polymer Chemistry welcomes submissions in all areas of polymer science that have a strong focus on macromolecular chemistry. Manuscripts may cover a broad range of fields, yet no direct application focus is required.