低磁损、高磁导率的FeSi/黑云母软磁复合材料

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shoujin Zhu, Chengwen Zhang, Weibing Wu, Songlin Zhou, Jiangli Ni, Shuangjiu Feng, Xiansong Liu, Xucai Kan, Dingni Shi
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引用次数: 0

摘要

采用球磨法制备了由硅铁(FeSi)和黑云母组成的软磁复合材料,并对其形貌和磁性进行了研究。扫描电镜显示,球磨的剪切力和破碎力导致层状黑云母被剥离和破碎成纳米片,纳米片均匀地粘附在FeSi颗粒上,形成无机绝缘涂层。黑云母的加入不仅降低了FeSi/黑云母复合材料的涡流损耗,而且提高了其弛豫频率。复合材料中,FeSi/1-wt;黑云母表现出优异的磁性,有效磁导率和磁损失分别为68.2和1879 kW/m3(在0.1 T和100 kHz下测量)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FeSi/biotite soft magnetic composites with low magnetic losses and high magnetic permeabilities

In this study, soft magnetic composites comprising ferrosilicon (FeSi) and biotite were prepared via ball milling, and their morphologic and magnetic characteristics were investigated. Scanning electron microscopy revealed that the shear and crushing forces of ball milling led to the stripping and crushing of the layered biotite into nanosheets, which uniformly adhered to the FeSi particles, forming inorganic insulating coatings. Incorporating biotite not only decreased the eddy current loss of the FeSi/biotite composite but also increased its relaxation frequency. Among the composites, FeSi/1-wt.% biotite exhibited outstanding magnetic characteristics, with respective effective permeability and magnetic loss of 68.2 and 1879 kW/m3 (measured at 0.1 T and 100 kHz).

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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