室温下V2O5薄膜Cr/V2O5/p-Si结二极管的综合电学特性

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zakir Çaldıran
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引用次数: 0

摘要

本研究探讨了五氧化钒(V2O5)薄膜在Cr/V2O5/p-Si/Al结二极管结构中的器件性能。实验装置使用电阻率为1-10 Ω/cm,厚度为400 μ m的p型硅(p-Si)晶圆,使用RCA1和RCA2协议进行化学清洗。铝(Al)沉积在晶圆片的一个表面作为背接触,并在580°C退火以建立欧姆行为。在相对表面热沉积10 nm的V2O5层,然后用直流溅射沉积100 nm的Cr层。为了比较,在相同的条件下制作了Cr/p-Si/Al参考器件,不包括V2O5层。电学测量,包括I-V和二极管参数分析,在室温下使用TE理论,张和Norde函数进行。采用TE方法得到的参考二极管的理想因数(IF)和势垒高度(BH)分别为2.03和0.58 eV,而基于v2o5的器件的理想因数(IF)和势垒高度(BH)分别为1.89 ~ 1.96和0.68 ~ 0.74 eV。性能最好的器件,即器件5,其IF值为1.90,BH值为0.74 eV。此外,在太阳模拟器下对该器件的光电二极管特性进行了分析。这些结果表明,V2O5界面层的加入改善了二极管的势垒性能,具有先进整流和光伏应用的潜力。器件中串联电阻(SR)和界面层的存在以及BH的不均匀性也被认为是导致中频增加的因素。C-V表征是理解肖特基型器件电气参数的另一项关键技术,用于计算性能最佳器件的BH和载流子浓度等重要参数。此外,分析了不同频率下的G/ ω-V和Z-V测量值,以更好地了解具有V2O5接口的器件的电学特性和表面/界面状态。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comprehensive electrical characterization of Cr/V2O5/p-Si junction diode with V2O5 thin film at room temperature

This study explores the device properties of vanadium pentoxide (V2O5) thin films in the Cr/V2O5/p-Si/Al junction diode structure. The experimental setup utilized p-type silicon (p-Si) wafers with a resistivity of 1–10 Ω/cm and a thickness of 400 µm, chemically cleaned using the RCA1 and RCA2 protocols. Aluminum (Al) was deposited on one surface of the wafer as a back contact and annealed at 580 °C to establish ohmic behavior. A 10 nm layer of V2O5 was thermally deposited on the opposite surface and followed by a 100 nm top contact of Cr was deposited by DC sputtering. For comparison, a Cr/p-Si/Al reference device was fabricated under identical conditions, excluding the V2O5 layer. Electrical measurements, including IV and diode parameter analyses, were performed at room temperature using TE theory, Cheung, and Norde functions. Ideality factor (IF) and barrier height (BH) for the reference diode from the TE method were determined to be 2.03 and 0.58 eV, while the 8 V2O5-based devices exhibited IF values ranging from 1.89 to 1.96 and BH values between 0.68 and 0.74 eV. The best performing device, designated device 5, achieved an IF value of 1.90 and a BH value of 0.74 eV. In addition, the photodiode properties of this device were analyzed under a solar simulator. These results indicate that the incorporation of the V2O5 interface layer improves the barrier properties of the diode and has potential for advanced rectification and photovoltaic applications. The presence of the series resistance (SR) and interface layer in the device and the inhomogeneity of the BH are also considered as factors contributing to that increase in IF. CV characterization, another critical technique for understanding the electrical parameters of Schottky-type devices, was used to calculate important parameters such as BH and carrier concentration for the best performing device. Furthermore, G/ωV and ZV measurements at different frequencies were analyzed to better understand the electrical properties and surface/interface states of the device with the V2O5 interface.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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