Sn-Ag-Cu-Al焊料低温超声辅助焊接SiCp/Al金属基复合材料

IF 8.1 2区材料科学 Q1 ENGINEERING, MANUFACTURING

Composites Part A: Applied Science and Manufacturing Pub Date : 2025-05-22 DOI:10.1016/j.compositesa.2025.109056

Guojing Xu , Xinran Ma , Wenkang Du , Pu Zhao , Yuanhang Xia , Zhengwei Li , Zhiwu Xu , Jiuchun Yan

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引用次数: 0

摘要

高体积分数SiC颗粒增强Al金属基复合材料（SiCp/Al- mmcs）的低温直接焊接具有挑战性，因为需要同时润湿和结合Al基体和SiC颗粒。在这项研究中，55 vol% SiCp/Al-MMCs在250℃的空气中使用活性Sn-Ag-Cu-Al焊料进行超声辅助焊接。钎料中的Al与空气中的O发生沉积反应，在Al基体与钎料之间形成Al2O3过渡层。在超声空化效应引起的局部高温和瞬态高温下，SiC与钎料之间形成了MgAl2O4 + Al2O3复合过渡层。基于声压模拟结果，热力学计算揭示了SiC表面SiO2与Al基体中活性元素（Al和Mg）之间的界面反应机理。结合界面结构在超声作用仅20 s的情况下，接头抗剪强度达到52.1 MPa。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Ultrasonic-assisted soldering of SiCp/Al metal matrix composites using Sn–Ag–Cu–Al solder at low temperatures

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Ultrasonic-assisted soldering of SiCp/Al metal matrix composites using Sn–Ag–Cu–Al solder at low temperatures

The direct soldering of high-volume-fraction SiC particle–reinforced Al metal matrix composites (SiCp/Al-MMCs) at low temperatures is challenging due to required simultaneous wetting and bonding of Al matrix and SiC particles. In this study, 55 vol% SiCp/Al-MMCs were ultrasonic-assisted soldered in air using an active Sn–Ag–Cu–Al solder at 250 ℃. The deposition reaction occurred of the Al in solder and O from air to form a transition layer of Al₂O₃ between the Al matrix and solder. A composite transition layer of MgAl₂O₄ + Al₂O₃ formed between the SiC and solder under localized and transient high temperatures induced by the ultrasonic cavitation effect. The thermodynamic calculation revealed the interfacial reaction mechanism between the SiO₂ on the SiC surface and active elements (Al and Mg) from the Al matrix based on acoustic pressure simulation results. The bonding interface structures ensured a high joint shear strength of 52.1 MPa with only 20 s of ultrasound action.

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来源期刊

Composites Part A: Applied Science and Manufacturing 工程技术-材料科学：复合

CiteScore

15.20

自引率

5.70%

发文量

492

审稿时长

30 days

期刊介绍： Composites Part A: Applied Science and Manufacturing is a comprehensive journal that publishes original research papers, review articles, case studies, short communications, and letters covering various aspects of composite materials science and technology. This includes fibrous and particulate reinforcements in polymeric, metallic, and ceramic matrices, as well as 'natural' composites like wood and biological materials. The journal addresses topics such as properties, design, and manufacture of reinforcing fibers and particles, novel architectures and concepts, multifunctional composites, advancements in fabrication and processing, manufacturing science, process modeling, experimental mechanics, microstructural characterization, interfaces, prediction and measurement of mechanical, physical, and chemical behavior, and performance in service. Additionally, articles on economic and commercial aspects, design, and case studies are welcomed. All submissions undergo rigorous peer review to ensure they contribute significantly and innovatively, maintaining high standards for content and presentation. The editorial team aims to expedite the review process for prompt publication.