{"title":"具有高击穿强度和静电能量密度的板状Bi4Ti3O12氟化聚酰亚胺纳米复合薄膜。","authors":"Zexue Lin,Weijia Wang,Yao Su,Ning Yang,Zhuo Zhang,Zhiyong Liao,Peizhi Dong,Ruizhe Zhang,Dengwei Hu,Huiqing Fan","doi":"10.1021/acsami.5c05854","DOIUrl":null,"url":null,"abstract":"Inorganic and organic nanocomposite dielectrics capable of high energy storage, fast charge-discharge speed, and high-temperature stability are in high demand for application in advanced electronic devices and electrical power systems. However, a major obstacle is the reasonable design of high-performance fillers that are conducive to the breakdown strength. In this work, inorganic-organic nanocomposite films prepared by blending two-dimensional (2D) plate-like Bi4Ti3O12 (BTO) with fluorinated polyimide (FPI) are reported. Benefiting from the 2D plate-like BTO, which acts as a physical barrier during the breakdown process, the resultant FPI nanocomposite films exhibit significantly improved breakdown strength over a wide temperature range. Especially, the 1 wt % BTO/FPI nanocomposite film achieves ultrahigh energy densities of 11.15 J cm-3 under 719.23 MV m-1 and 5.72 J cm-3 under 562.52 MV m-1 at room temperature and 150 °C, respectively. The performance at 150 °C outperforms most of the reported dielectric nanocomposites. This work offers a valuable insight for the development of dielectric fillers with a high aspect ratio, facilitating the progression of high-performance dielectric polymer nanocomposite films.","PeriodicalId":5,"journal":{"name":"ACS Applied Materials & Interfaces","volume":"26 1","pages":""},"PeriodicalIF":8.2000,"publicationDate":"2025-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fluorinated Polyimide Nanocomposite Films Incorporated with Plate-like Bi4Ti3O12 Capable of High Breakdown Strength and Electrostatic Energy Density.\",\"authors\":\"Zexue Lin,Weijia Wang,Yao Su,Ning Yang,Zhuo Zhang,Zhiyong Liao,Peizhi Dong,Ruizhe Zhang,Dengwei Hu,Huiqing Fan\",\"doi\":\"10.1021/acsami.5c05854\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Inorganic and organic nanocomposite dielectrics capable of high energy storage, fast charge-discharge speed, and high-temperature stability are in high demand for application in advanced electronic devices and electrical power systems. However, a major obstacle is the reasonable design of high-performance fillers that are conducive to the breakdown strength. In this work, inorganic-organic nanocomposite films prepared by blending two-dimensional (2D) plate-like Bi4Ti3O12 (BTO) with fluorinated polyimide (FPI) are reported. Benefiting from the 2D plate-like BTO, which acts as a physical barrier during the breakdown process, the resultant FPI nanocomposite films exhibit significantly improved breakdown strength over a wide temperature range. Especially, the 1 wt % BTO/FPI nanocomposite film achieves ultrahigh energy densities of 11.15 J cm-3 under 719.23 MV m-1 and 5.72 J cm-3 under 562.52 MV m-1 at room temperature and 150 °C, respectively. The performance at 150 °C outperforms most of the reported dielectric nanocomposites. This work offers a valuable insight for the development of dielectric fillers with a high aspect ratio, facilitating the progression of high-performance dielectric polymer nanocomposite films.\",\"PeriodicalId\":5,\"journal\":{\"name\":\"ACS Applied Materials & Interfaces\",\"volume\":\"26 1\",\"pages\":\"\"},\"PeriodicalIF\":8.2000,\"publicationDate\":\"2025-05-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ACS Applied Materials & Interfaces\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1021/acsami.5c05854\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Materials & Interfaces","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acsami.5c05854","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Fluorinated Polyimide Nanocomposite Films Incorporated with Plate-like Bi4Ti3O12 Capable of High Breakdown Strength and Electrostatic Energy Density.
Inorganic and organic nanocomposite dielectrics capable of high energy storage, fast charge-discharge speed, and high-temperature stability are in high demand for application in advanced electronic devices and electrical power systems. However, a major obstacle is the reasonable design of high-performance fillers that are conducive to the breakdown strength. In this work, inorganic-organic nanocomposite films prepared by blending two-dimensional (2D) plate-like Bi4Ti3O12 (BTO) with fluorinated polyimide (FPI) are reported. Benefiting from the 2D plate-like BTO, which acts as a physical barrier during the breakdown process, the resultant FPI nanocomposite films exhibit significantly improved breakdown strength over a wide temperature range. Especially, the 1 wt % BTO/FPI nanocomposite film achieves ultrahigh energy densities of 11.15 J cm-3 under 719.23 MV m-1 and 5.72 J cm-3 under 562.52 MV m-1 at room temperature and 150 °C, respectively. The performance at 150 °C outperforms most of the reported dielectric nanocomposites. This work offers a valuable insight for the development of dielectric fillers with a high aspect ratio, facilitating the progression of high-performance dielectric polymer nanocomposite films.
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.