Yongshan Li
(, ), Guangchang Chen
(, ), Jingran Ge
(, ), Kai Liu
(, ), Jun Liang
(, )
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Modeling of curing process and residual stress analysis of thick-section thermosetting composites
The curing behavior of composites significantly influences their performance, making it crucial to understand the curing process. This study experimentally measured specific heat capacity, thermal conductivity, glass transition temperature, coefficient of thermal expansion, and cure shrinkage of materials. A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments. The effects of thickness, heating rate, and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.
期刊介绍:
Acta Mechanica Sinica, sponsored by the Chinese Society of Theoretical and Applied Mechanics, promotes scientific exchanges and collaboration among Chinese scientists in China and abroad. It features high quality, original papers in all aspects of mechanics and mechanical sciences.
Not only does the journal explore the classical subdivisions of theoretical and applied mechanics such as solid and fluid mechanics, it also explores recently emerging areas such as biomechanics and nanomechanics. In addition, the journal investigates analytical, computational, and experimental progresses in all areas of mechanics. Lastly, it encourages research in interdisciplinary subjects, serving as a bridge between mechanics and other branches of engineering and the sciences.
In addition to research papers, Acta Mechanica Sinica publishes reviews, notes, experimental techniques, scientific events, and other special topics of interest.
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