用于数模电阻开关的ZnO薄膜导电丝的定向掺杂诱导调制

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Phu-Quan Pham, Ngoc Hong Nguyen, Lien Hoang Huynh, Tai Anh Van Vo, Thuy-Anh Tran, Truong Huu Nguyen, Hoa Thi Lai, Duy Thai Le, Thang Bach Phan, Ngoc Kim Pham
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引用次数: 0

摘要

本文介绍了一种基于铜掺杂纤锌矿ZnO薄膜的模拟忆阻器的制备和分析方法。结构和形态表征证实了均匀的Cu掺入而不影响薄膜质量。Cr/ZnO/Cr和Cr/ZnO:Cu/Cr器件均表现出稳定的电阻开关。I-V拟合表明,未掺杂的ZnO在空间电荷限制电流下通过导电丝开关,而Cu掺杂则引入了激活Poole-Frenkel传导的深阱。这种转换可以实现可调谐的多电平模拟开关。此外,在高偏置下产生的氧空位扩大了开/关比并降低了SET电压。这些结果突出了低成本、掺杂氧化物在神经形态计算中的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Targeted doping-induced modulation of conductive filaments in ZnO films for digital-to-analog resistive switching

We present the fabrication and analysis of analog memristors based on Cu-doped wurtzite ZnO thin films deposited via stencil-assisted sputtering. Structural and morphological characterizations confirm uniform Cu incorporation without compromising film quality. Cr/ZnO/Cr and Cr/ZnO:Cu/Cr devices both show stable resistive switching. I–V fitting reveals that undoped ZnO switches via conductive filaments under space charge–limited current, while Cu doping introduces deep traps that activate Poole–Frenkel conduction. This transition enables tunable, multilevel analog switching. Additionally, oxygen vacancies generated under high bias expand the ON/OFF ratio and lower the SET voltage. These results highlight the potential of low-cost, doped oxides for neuromorphic computing.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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