{"title":"Pb-16Sn-7.5Sb-xAg/Ni接头组织演变及剪切行为","authors":"Fan Wang, Xiaodi Zhang, Richu Wang, Jian Peng","doi":"10.1007/s10854-025-14829-5","DOIUrl":null,"url":null,"abstract":"<div><p>The Pb16Sn7.5Sb-based solder with a melting point of 240 °C can be used as an ideal candidate solder in this temperature range. The microstructure and shear strength of Pb16Sn7.5Sb-xAg/Ni solder joints after soldering for 2 ~ 60 min were investigated in present work. The Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phases formed at the interface of the Pb-16Sn-7.5Sb-xAg/Ni joints. The thickness of Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phases was proportional to the square root of time. However, the Ag addition increased the activation energy of the Ni<sub>3</sub>Sn<sub>2</sub> and NiSb phases, which inhibited the rapid growth of the Ni<sub>3</sub>Sn<sub>2</sub> and NiSb phases. Therefore, the thickness of Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phases of Pb16Sn7.5Sb-1Ag/Ni joint was 0.35 μm after soldering for 2 min, the shear strength of the joint can reach 25.9 MPa. The shear strength increased to 32.5 MPa when the thickness of the Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phase was 0.38 μm after 5 min soldering. It decreased to 23.5 MPa after prolonged the soldering time as the Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phase thickness increased. A uniform Ni<sub>3</sub>Sn<sub>2</sub> + NiSb layer with adequate thickness is the key for the mechanical properties of the Pb-16Sn-7.5Sb-xAg/Ni.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 14","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructure evolution and shear behavior of Pb-16Sn-7.5Sb-xAg/Ni joints\",\"authors\":\"Fan Wang, Xiaodi Zhang, Richu Wang, Jian Peng\",\"doi\":\"10.1007/s10854-025-14829-5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The Pb16Sn7.5Sb-based solder with a melting point of 240 °C can be used as an ideal candidate solder in this temperature range. The microstructure and shear strength of Pb16Sn7.5Sb-xAg/Ni solder joints after soldering for 2 ~ 60 min were investigated in present work. The Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phases formed at the interface of the Pb-16Sn-7.5Sb-xAg/Ni joints. The thickness of Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phases was proportional to the square root of time. However, the Ag addition increased the activation energy of the Ni<sub>3</sub>Sn<sub>2</sub> and NiSb phases, which inhibited the rapid growth of the Ni<sub>3</sub>Sn<sub>2</sub> and NiSb phases. Therefore, the thickness of Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phases of Pb16Sn7.5Sb-1Ag/Ni joint was 0.35 μm after soldering for 2 min, the shear strength of the joint can reach 25.9 MPa. The shear strength increased to 32.5 MPa when the thickness of the Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phase was 0.38 μm after 5 min soldering. It decreased to 23.5 MPa after prolonged the soldering time as the Ni<sub>3</sub>Sn<sub>2</sub> + NiSb phase thickness increased. A uniform Ni<sub>3</sub>Sn<sub>2</sub> + NiSb layer with adequate thickness is the key for the mechanical properties of the Pb-16Sn-7.5Sb-xAg/Ni.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 14\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14829-5\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14829-5","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Microstructure evolution and shear behavior of Pb-16Sn-7.5Sb-xAg/Ni joints
The Pb16Sn7.5Sb-based solder with a melting point of 240 °C can be used as an ideal candidate solder in this temperature range. The microstructure and shear strength of Pb16Sn7.5Sb-xAg/Ni solder joints after soldering for 2 ~ 60 min were investigated in present work. The Ni3Sn2 + NiSb phases formed at the interface of the Pb-16Sn-7.5Sb-xAg/Ni joints. The thickness of Ni3Sn2 + NiSb phases was proportional to the square root of time. However, the Ag addition increased the activation energy of the Ni3Sn2 and NiSb phases, which inhibited the rapid growth of the Ni3Sn2 and NiSb phases. Therefore, the thickness of Ni3Sn2 + NiSb phases of Pb16Sn7.5Sb-1Ag/Ni joint was 0.35 μm after soldering for 2 min, the shear strength of the joint can reach 25.9 MPa. The shear strength increased to 32.5 MPa when the thickness of the Ni3Sn2 + NiSb phase was 0.38 μm after 5 min soldering. It decreased to 23.5 MPa after prolonged the soldering time as the Ni3Sn2 + NiSb phase thickness increased. A uniform Ni3Sn2 + NiSb layer with adequate thickness is the key for the mechanical properties of the Pb-16Sn-7.5Sb-xAg/Ni.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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