石墨烯基聚合物油墨在纺织品表面长期循环稳定性中的界面应力转移

Monika Swami, Shanu Prabhakar, Susanta Ghosh and Debmalya Roy
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引用次数: 0

摘要

石墨烯基导电油墨的粘度对印刷的几何形状有显著的影响,并且可以通过调节交联密度来控制。多孔衬底,如纺织品表面,已被选择用于印刷,以强调纳米填料在循环弯曲过程中的结构形成。在弹性体基体中,石墨烯的负载被刻意选择在渗透阈值之外,以深入了解织物衬底上的导电网络通道。结构性能分析表明,在循环应力作用下,石墨烯在纺织纱线上形成了稳定的导电几何形状。研究发现,工艺参数在制造致密、导电的油墨填充纺织基材中起着至关重要的作用,它通过施加应力来重组柔性薄膜的结构完整性。石墨烯薄片的柔韧性至关重要,因为它可以使它们与织物表面保持一致,从而增强润湿性,并最大限度地减少应力集中。织物材料的组成在增强与导电层的粘附性方面起着重要作用,从而有助于整体电阻的稳定性。石墨烯基油墨的配方和加工已经进行了优化,以实现柔性导电油墨在能够承受弯曲应力的纺织品表面上的一致沉积,使其成为下一代可穿戴电子产品应用的理想选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Interfacial stress transfer in graphene-based polymeric inks on a textile surface for long term cycling stability

The viscosity of graphene-based conducting ink has been shown to significantly affect printed geometries, and it has been illustrated that it can be controlled by adjusting the crosslinking density. A porous substrate, such as a textile surface, has been selected for printing to emphasize the structure formation of nanofillers during cyclic bending. The graphene loading in the elastomer matrix was deliberately chosen beyond the percolation threshold to gain insight into the conducting network channels on the fabric substrate. Structure–property analysis revealed the formation of stable conducting geometries of graphene on textile yarns under cyclic stress. The processing parameters have been found to play a crucial role in fabricating a tightly packed, conducting ink-filled textile substrate, which reorganizes the structural integrity of the flexible film by application of stress. The flexibility of graphene flakes is found to be critical as it allows them to conform to the fabric's surface for enhanced wetting and to minimize the stress concentration. The composition of fabric materials plays an important role in enhancing adhesion with conducting layers, thus contributing to the overall resistance stability. Formulation and processing of graphene-based inks have been optimized to achieve consistent deposition of flexible conductive ink on textile surfaces capable of enduring bending stress, making it ideal for the next generation of wearable electronics applications.

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