Tinghong Gao , Qi Li , Kejun Dong , Guiyang Liu , Wanjun Yan , Jin Huang , Han Song , Zhan zhang
{"title":"激光辅助磨削过程中碳化硅/铝复合材料亚表面损伤机理的分子模拟研究","authors":"Tinghong Gao , Qi Li , Kejun Dong , Guiyang Liu , Wanjun Yan , Jin Huang , Han Song , Zhan zhang","doi":"10.1016/j.physb.2025.417394","DOIUrl":null,"url":null,"abstract":"<div><div>Silicon carbide/aluminum (SiC/Al) composites are extensively utilized in applications requiring high temperatures, frequencies, power densities, and radiation resistance because of their exceptional physical and electronic properties. They exhibit high toughness, fatigue resistance, strength, and wear resistance as well as a low thermal expansion coefficient. This research investigates the behavior of SiC/Al composites when subjected to single-particle laser-assisted grinding through molecular dynamics simulations and probes the grinding force, stress distribution, subsurface damage mechanism and the dynamic characteristics of topologically close-packed (TCP). The primary objective is to provide theoretical support for optimizing SiC/Al parameters in ultraprecision grinding. The findings highlight the pivotal role of the laser power density in the damage progression of SiC/Al composites. With increasing laser power density, the temperature within the SiC region increases, promoting the crystalline–amorphous transition of the SiC composite. Compared to traditional grinding methods, laser-assisted grinding exhibits superior efficacy in reducing subsurface damage depth and reducing the grinding forces acting on the abrasive in all directions. Furthermore, the laser power density substantially influences the deformation characteristics, stress distribution, and grinding force on the workpiece surface during laser-assisted grinding. Applying optimal laser power density can substantially decrease SiC atom extrusion toward the Al side, thereby minimizing material damage and enhancing processing efficiency.</div></div>","PeriodicalId":20116,"journal":{"name":"Physica B-condensed Matter","volume":"713 ","pages":"Article 417394"},"PeriodicalIF":2.8000,"publicationDate":"2025-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Molecular simulation study of the subsurface damage mechanism of silicon carbide/aluminum composites during laser-assisted grinding\",\"authors\":\"Tinghong Gao , Qi Li , Kejun Dong , Guiyang Liu , Wanjun Yan , Jin Huang , Han Song , Zhan zhang\",\"doi\":\"10.1016/j.physb.2025.417394\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Silicon carbide/aluminum (SiC/Al) composites are extensively utilized in applications requiring high temperatures, frequencies, power densities, and radiation resistance because of their exceptional physical and electronic properties. They exhibit high toughness, fatigue resistance, strength, and wear resistance as well as a low thermal expansion coefficient. This research investigates the behavior of SiC/Al composites when subjected to single-particle laser-assisted grinding through molecular dynamics simulations and probes the grinding force, stress distribution, subsurface damage mechanism and the dynamic characteristics of topologically close-packed (TCP). The primary objective is to provide theoretical support for optimizing SiC/Al parameters in ultraprecision grinding. The findings highlight the pivotal role of the laser power density in the damage progression of SiC/Al composites. With increasing laser power density, the temperature within the SiC region increases, promoting the crystalline–amorphous transition of the SiC composite. Compared to traditional grinding methods, laser-assisted grinding exhibits superior efficacy in reducing subsurface damage depth and reducing the grinding forces acting on the abrasive in all directions. Furthermore, the laser power density substantially influences the deformation characteristics, stress distribution, and grinding force on the workpiece surface during laser-assisted grinding. Applying optimal laser power density can substantially decrease SiC atom extrusion toward the Al side, thereby minimizing material damage and enhancing processing efficiency.</div></div>\",\"PeriodicalId\":20116,\"journal\":{\"name\":\"Physica B-condensed Matter\",\"volume\":\"713 \",\"pages\":\"Article 417394\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-05-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Physica B-condensed Matter\",\"FirstCategoryId\":\"101\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0921452625005113\",\"RegionNum\":3,\"RegionCategory\":\"物理与天体物理\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"PHYSICS, CONDENSED MATTER\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Physica B-condensed Matter","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0921452625005113","RegionNum":3,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"PHYSICS, CONDENSED MATTER","Score":null,"Total":0}
Molecular simulation study of the subsurface damage mechanism of silicon carbide/aluminum composites during laser-assisted grinding
Silicon carbide/aluminum (SiC/Al) composites are extensively utilized in applications requiring high temperatures, frequencies, power densities, and radiation resistance because of their exceptional physical and electronic properties. They exhibit high toughness, fatigue resistance, strength, and wear resistance as well as a low thermal expansion coefficient. This research investigates the behavior of SiC/Al composites when subjected to single-particle laser-assisted grinding through molecular dynamics simulations and probes the grinding force, stress distribution, subsurface damage mechanism and the dynamic characteristics of topologically close-packed (TCP). The primary objective is to provide theoretical support for optimizing SiC/Al parameters in ultraprecision grinding. The findings highlight the pivotal role of the laser power density in the damage progression of SiC/Al composites. With increasing laser power density, the temperature within the SiC region increases, promoting the crystalline–amorphous transition of the SiC composite. Compared to traditional grinding methods, laser-assisted grinding exhibits superior efficacy in reducing subsurface damage depth and reducing the grinding forces acting on the abrasive in all directions. Furthermore, the laser power density substantially influences the deformation characteristics, stress distribution, and grinding force on the workpiece surface during laser-assisted grinding. Applying optimal laser power density can substantially decrease SiC atom extrusion toward the Al side, thereby minimizing material damage and enhancing processing efficiency.
期刊介绍:
Physica B: Condensed Matter comprises all condensed matter and material physics that involve theoretical, computational and experimental work.
Papers should contain further developments and a proper discussion on the physics of experimental or theoretical results in one of the following areas:
-Magnetism
-Materials physics
-Nanostructures and nanomaterials
-Optics and optical materials
-Quantum materials
-Semiconductors
-Strongly correlated systems
-Superconductivity
-Surfaces and interfaces