K. Kanchana, K. J. Anoop, V. P. Vinod, K. K. Kavitha, Mathur Nadarajan Kathiravan
{"title":"表面改性多孔西瓜皮生物炭肉豆蔻短纤维增强轻质乙烯基酯生物复合材料的电磁屏蔽效果","authors":"K. Kanchana, K. J. Anoop, V. P. Vinod, K. K. Kavitha, Mathur Nadarajan Kathiravan","doi":"10.1007/s10854-025-14878-w","DOIUrl":null,"url":null,"abstract":"<div><p>The present research aims to develop an Electromagnetic interference (EMI) shielding which is light weight by natural fiber, and filler reinforced polymer composite. The novelty of this study producing composite using waste biomass by treating the fiber and filler surface modification. As well as analysing the mechanical, dielectric, and EMI shielding efficiency of the composite in accordance to the ASTM (American Society for Testing and Materials) standard. The study founded that composite VNB2, with 2.0 vol.% biochar and 30 vol.% silane-treated nutmeg shell fiber, demonstrates the best mechanical performance, with a tensile strength of 154 MPa, tensile modulus of 5.6 GPa, flexural strength of 221 MPa, flexural modulus of 6.1 GPa, and it is 175%, 229.4%, 151.1%, 177.3%, respectively. However, the impact strength and hardness properties are improved with increase filler content of 4 vol.% of biochar and 30 vol.% silane-treated nutmeg shell fiber on composite VNB3, that is 5.8 J, and 90 shore-d and it is 383.3%and 9.8% increase when compared plain vinyl ester composite V, respectively, suggests that the combination of fiber and biochar provides excellent toughness. Similarly, the dielectric constant of VNB3 reaches 6.62, 5.57, 4.41, and 3.89 at E, F, I, and J, respectively, which it is 97.02%, 104.02%, 99.54%, 131.54%, respectively, due to the formation of conductive networks and improved interfacial polarization. Additionally, the highest EMI shielding effectiveness is observed in VNB3, reaching 8.82, 14.28, 20.16, and 29.82 dB at E, F, I, and J, respectively and it is 299.09% 61.90%, 52.38% 50.22%, respectively, indicating that the increased biochar content enhances charge transport and multiple reflections, optimizing wave attenuation. Owing to such features it could be applied in most of electric and electronic equipment used industries like space craft, communication, navigation, medical, automobile, and information technology, etc.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 14","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electromagnetic shielding effectiveness of surface modified porous watermelon rinds biochar nutmeg short fibre reinforced lightweight vinyl ester biocomposite\",\"authors\":\"K. Kanchana, K. J. Anoop, V. P. Vinod, K. K. Kavitha, Mathur Nadarajan Kathiravan\",\"doi\":\"10.1007/s10854-025-14878-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The present research aims to develop an Electromagnetic interference (EMI) shielding which is light weight by natural fiber, and filler reinforced polymer composite. The novelty of this study producing composite using waste biomass by treating the fiber and filler surface modification. As well as analysing the mechanical, dielectric, and EMI shielding efficiency of the composite in accordance to the ASTM (American Society for Testing and Materials) standard. The study founded that composite VNB2, with 2.0 vol.% biochar and 30 vol.% silane-treated nutmeg shell fiber, demonstrates the best mechanical performance, with a tensile strength of 154 MPa, tensile modulus of 5.6 GPa, flexural strength of 221 MPa, flexural modulus of 6.1 GPa, and it is 175%, 229.4%, 151.1%, 177.3%, respectively. However, the impact strength and hardness properties are improved with increase filler content of 4 vol.% of biochar and 30 vol.% silane-treated nutmeg shell fiber on composite VNB3, that is 5.8 J, and 90 shore-d and it is 383.3%and 9.8% increase when compared plain vinyl ester composite V, respectively, suggests that the combination of fiber and biochar provides excellent toughness. Similarly, the dielectric constant of VNB3 reaches 6.62, 5.57, 4.41, and 3.89 at E, F, I, and J, respectively, which it is 97.02%, 104.02%, 99.54%, 131.54%, respectively, due to the formation of conductive networks and improved interfacial polarization. Additionally, the highest EMI shielding effectiveness is observed in VNB3, reaching 8.82, 14.28, 20.16, and 29.82 dB at E, F, I, and J, respectively and it is 299.09% 61.90%, 52.38% 50.22%, respectively, indicating that the increased biochar content enhances charge transport and multiple reflections, optimizing wave attenuation. Owing to such features it could be applied in most of electric and electronic equipment used industries like space craft, communication, navigation, medical, automobile, and information technology, etc.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 14\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14878-w\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14878-w","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Electromagnetic shielding effectiveness of surface modified porous watermelon rinds biochar nutmeg short fibre reinforced lightweight vinyl ester biocomposite
The present research aims to develop an Electromagnetic interference (EMI) shielding which is light weight by natural fiber, and filler reinforced polymer composite. The novelty of this study producing composite using waste biomass by treating the fiber and filler surface modification. As well as analysing the mechanical, dielectric, and EMI shielding efficiency of the composite in accordance to the ASTM (American Society for Testing and Materials) standard. The study founded that composite VNB2, with 2.0 vol.% biochar and 30 vol.% silane-treated nutmeg shell fiber, demonstrates the best mechanical performance, with a tensile strength of 154 MPa, tensile modulus of 5.6 GPa, flexural strength of 221 MPa, flexural modulus of 6.1 GPa, and it is 175%, 229.4%, 151.1%, 177.3%, respectively. However, the impact strength and hardness properties are improved with increase filler content of 4 vol.% of biochar and 30 vol.% silane-treated nutmeg shell fiber on composite VNB3, that is 5.8 J, and 90 shore-d and it is 383.3%and 9.8% increase when compared plain vinyl ester composite V, respectively, suggests that the combination of fiber and biochar provides excellent toughness. Similarly, the dielectric constant of VNB3 reaches 6.62, 5.57, 4.41, and 3.89 at E, F, I, and J, respectively, which it is 97.02%, 104.02%, 99.54%, 131.54%, respectively, due to the formation of conductive networks and improved interfacial polarization. Additionally, the highest EMI shielding effectiveness is observed in VNB3, reaching 8.82, 14.28, 20.16, and 29.82 dB at E, F, I, and J, respectively and it is 299.09% 61.90%, 52.38% 50.22%, respectively, indicating that the increased biochar content enhances charge transport and multiple reflections, optimizing wave attenuation. Owing to such features it could be applied in most of electric and electronic equipment used industries like space craft, communication, navigation, medical, automobile, and information technology, etc.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.