双面聚酰胺薄膜的高透厚导热性。

IF 9.1 1区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY
Xiuqiang Li,Guangxin Lv,Yinglong Hu,Yu-Hsuan Tsao,Renjiu Hu,Zhiting Tian,Kejun Liu,Hao Ma
{"title":"双面聚酰胺薄膜的高透厚导热性。","authors":"Xiuqiang Li,Guangxin Lv,Yinglong Hu,Yu-Hsuan Tsao,Renjiu Hu,Zhiting Tian,Kejun Liu,Hao Ma","doi":"10.1021/acs.nanolett.5c01036","DOIUrl":null,"url":null,"abstract":"High thermal conductivity is essential for polymer applications such as electronic chip encapsulation, where efficient heat dissipation ensures system functionality and reliability. Here, we introduce a novel strategy to enhance through-plane thermal conductivity in 2D covalent organic frameworks (COFs). A highly crystalline edge-on 2D polyamide (v2DPA) film achieves a thermal conductivity of 1.16 ± 0.05 W/(mK) at 310 K, surpassing the previous record (1.03 W/(mK) in COF-5 [Evans et al. Nat. Mater. 2021, 20, 1142]) and aligning with molecular dynamics predictions (1.11 ± 0.07 W/(mK)). This value is nearly three times higher than that of bulk PA (0.34 ± 0.03 W/(mK)). Phonon dispersion calculations attribute this enhancement to strong covalent bonding, increasing phonon lifetimes, and group velocities. Our findings highlight the effectiveness of orienting 2D polymer and layer-stacked 2D COF films in an edge-on configuration to improve through-thickness thermal conductivity, offering a promising pathway for their integration into electronic thermal management applications.","PeriodicalId":53,"journal":{"name":"Nano Letters","volume":"14 1","pages":""},"PeriodicalIF":9.1000,"publicationDate":"2025-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High Through-Thickness Thermal Conductivity in an Edge-On Two-Dimensional Polyamide Thin Film.\",\"authors\":\"Xiuqiang Li,Guangxin Lv,Yinglong Hu,Yu-Hsuan Tsao,Renjiu Hu,Zhiting Tian,Kejun Liu,Hao Ma\",\"doi\":\"10.1021/acs.nanolett.5c01036\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High thermal conductivity is essential for polymer applications such as electronic chip encapsulation, where efficient heat dissipation ensures system functionality and reliability. Here, we introduce a novel strategy to enhance through-plane thermal conductivity in 2D covalent organic frameworks (COFs). A highly crystalline edge-on 2D polyamide (v2DPA) film achieves a thermal conductivity of 1.16 ± 0.05 W/(mK) at 310 K, surpassing the previous record (1.03 W/(mK) in COF-5 [Evans et al. Nat. Mater. 2021, 20, 1142]) and aligning with molecular dynamics predictions (1.11 ± 0.07 W/(mK)). This value is nearly three times higher than that of bulk PA (0.34 ± 0.03 W/(mK)). Phonon dispersion calculations attribute this enhancement to strong covalent bonding, increasing phonon lifetimes, and group velocities. Our findings highlight the effectiveness of orienting 2D polymer and layer-stacked 2D COF films in an edge-on configuration to improve through-thickness thermal conductivity, offering a promising pathway for their integration into electronic thermal management applications.\",\"PeriodicalId\":53,\"journal\":{\"name\":\"Nano Letters\",\"volume\":\"14 1\",\"pages\":\"\"},\"PeriodicalIF\":9.1000,\"publicationDate\":\"2025-05-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nano Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1021/acs.nanolett.5c01036\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nano Letters","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acs.nanolett.5c01036","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

摘要

高导热性对于电子芯片封装等聚合物应用至关重要,在这些应用中,高效的散热确保了系统的功能和可靠性。在这里,我们介绍了一种新的策略来提高二维共价有机框架(COFs)的通平面导热性。一种高度结晶的二维聚酰胺(v2DPA)薄膜在310 K时的导热系数为1.16±0.05 W/(mK),超过了COF-5之前的记录(1.03 W/(mK)) [Evans等人]。分子动力学预测(1.11±0.07 W/(mK))该值几乎是体PA(0.34±0.03 W/(mK))的3倍。声子色散计算将这种增强归因于强共价键,增加声子寿命和群速度。我们的研究结果强调了定向二维聚合物和分层堆叠的二维COF薄膜在边缘配置中的有效性,以提高通过厚度的导热性,为其集成到电子热管理应用中提供了一条有希望的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High Through-Thickness Thermal Conductivity in an Edge-On Two-Dimensional Polyamide Thin Film.
High thermal conductivity is essential for polymer applications such as electronic chip encapsulation, where efficient heat dissipation ensures system functionality and reliability. Here, we introduce a novel strategy to enhance through-plane thermal conductivity in 2D covalent organic frameworks (COFs). A highly crystalline edge-on 2D polyamide (v2DPA) film achieves a thermal conductivity of 1.16 ± 0.05 W/(mK) at 310 K, surpassing the previous record (1.03 W/(mK) in COF-5 [Evans et al. Nat. Mater. 2021, 20, 1142]) and aligning with molecular dynamics predictions (1.11 ± 0.07 W/(mK)). This value is nearly three times higher than that of bulk PA (0.34 ± 0.03 W/(mK)). Phonon dispersion calculations attribute this enhancement to strong covalent bonding, increasing phonon lifetimes, and group velocities. Our findings highlight the effectiveness of orienting 2D polymer and layer-stacked 2D COF films in an edge-on configuration to improve through-thickness thermal conductivity, offering a promising pathway for their integration into electronic thermal management applications.
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来源期刊
Nano Letters
Nano Letters 工程技术-材料科学:综合
CiteScore
16.80
自引率
2.80%
发文量
1182
审稿时长
1.4 months
期刊介绍: Nano Letters serves as a dynamic platform for promptly disseminating original results in fundamental, applied, and emerging research across all facets of nanoscience and nanotechnology. A pivotal criterion for inclusion within Nano Letters is the convergence of at least two different areas or disciplines, ensuring a rich interdisciplinary scope. The journal is dedicated to fostering exploration in diverse areas, including: - Experimental and theoretical findings on physical, chemical, and biological phenomena at the nanoscale - Synthesis, characterization, and processing of organic, inorganic, polymer, and hybrid nanomaterials through physical, chemical, and biological methodologies - Modeling and simulation of synthetic, assembly, and interaction processes - Realization of integrated nanostructures and nano-engineered devices exhibiting advanced performance - Applications of nanoscale materials in living and environmental systems Nano Letters is committed to advancing and showcasing groundbreaking research that intersects various domains, fostering innovation and collaboration in the ever-evolving field of nanoscience and nanotechnology.
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