Advanced strategies for thermal conductivity enhancement in polymer composites for application as thermal management materials

Significant heat generation is observed in advanced miniature, thin, lightweight, and high-performance electronic devices, highlighting the importance of thermal control and thermal management technologies. To address excess heat generation, developing more efficient electronic packaging with thermal management materials that facilitate heat dissipation is critical for ensuring the durability and optimal functionality of electronic devices. Polymer composites are widely used as thermal management materials owing to their excellent adhesion, ease of fabrication, lightness, and robust mechanical properties; however, these systems typically exhibit lower thermal conductivities than metals and ceramics. Thus, several studies have attempted to improve the thermal properties of polymer composites. This review discusses various polymer composites and highlights the importance of thermal-pathway management for thermal conductivity enhancement, focusing on strategies for controlling the polymer-chain structure and interactions as well as optimizing the polymer–filler, and filler–filler interfaces in composites. This paper is expected to guide future research on high-performance polymer composites for specific thermal-management applications.

Graphic abstract

The utilization of high thermal conductivity polymers is critical for enhancing the thermal performance of polymer composites. Polymers such as aligned semi-crystalline polymers, stretched amorphous polymers, and liquid crystalline polymers, which inherently exhibit superior thermal conductivity, significantly enhance the overall thermal conductivity of composites when used as the matrix, especially compared to those based on low thermal conductivity polymers. In this review, we highlight various approaches to enhancing thermal conductivity in polymers, including strategies such as optimizing molecular alignment, enhancing crystalline structures, and integrating highly conductive fillers.