基于对齐设计信息的稳健PCB异常检测

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Kunting Luo;Yanxia Liu;Zihe Yu
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引用次数: 0

摘要

印刷电路板(PCB)是现代电子产品的关键部件,确保其高质量是优化设备功能的必要条件。基于无监督学习的异常检测方法可以仅使用无缺陷的样品来识别PCB缺陷,从而降低了人工成本。然而,这些方法可能会忽略来自格伯的有价值的参考信息——PCB设计信息。利用这些信息有可能极大地提高识别PCB缺陷的精度。我们提出了第一个利用Gerber的PCB异常检测框架。具体来说,我们使用固定的实景图像提取器从实景图像中提取特征,然后通过Gerber特征提取器和变压器将提取的Gerber特征转换为实景图像特征。通过将变换后的特征与实际图像特征进行比较,实现了有效的PCB异常检测。此外,考虑到Gerber和真实图像之间的潜在偏移差异,以及数据收集中存在的噪声,我们引入了偏移容忍匹配(OTM)算法和噪声弹性方案,以增强模型的鲁棒性。通过对从真实生产环境中收集的工业数据进行实验,我们提出的方法实现了90.46%的AP和96.23%的AUROC性能,显示了最先进的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Robust PCB Anomaly Detection Using Aligned Design Information
Printed circuit board (PCB) is a critical component in modern electronic products, and ensuring its high quality is essential for optimal device functioning. Unsupervised learning-based anomaly detection methods can identify PCB defects using only defect-free samples, reducing labor costs. However, these methods may overlook valuable reference information from Gerber—the PCB design information. Leveraging this information has the potential to greatly enhance the precision of identifying PCB defects. We propose the first PCB anomaly detection framework utilizing Gerber. Specifically, we use a fixed real image extractor to extract features from real images, and then transform the extracted Gerber features into real image features through a Gerber feature extractor and transformer. By comparing the transformed features with the real image features, we achieve effective PCB anomaly detection. Furthermore, taking into account potential discrepancies in offset between Gerber and real images, as well as the presence of noise in data collection, we have introduced an offset-tolerant matching (OTM) algorithm and a noise-resilient scheme to bolster the robustness of the model. Through experiments conducted on industrial data collected from real production environments, our proposed approach achieves a performance of 90.46% AP and 96.23% AUROC, demonstrating state-of-the-art results.
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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