Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications

With the rapid advancement of modern electronics, circuits are becoming more integrated and denser, supporting Moore’s Law. High density and high-power integrated circuits (ICs) generate a large amount of heat that needs to be neutralized. In dealing with this thermal management issue, many approaches in semiconductor packaging have arisen. One of the most effective methods to resolve high heat generation involves synthesizing epoxy-based composites with high thermal conductivity fillers. In this review, alumina fillers are examined for their high thermal conductivity (∼30 W/(m·K)), as well as for their additional benefit of electrical insulation. Various types of alumina fillers exist and are examined in this study. They range from zero-dimensional nano- and micro-particles to three-dimensional hybrid fillers. Thermal and electrical mechanical properties are discussed and compared among the different alumina fillers. Filler preparation in the composite and its effects on thermal performance are also reviewed. Finally, a summarizing outlook is discussed regarding potential challenges and future applications of alumina epoxy composites in advanced packaging.