{"title":"真空热等静压诱导共格界面裁剪增材制备Ti2AlNb合金的高温抗蠕变性能","authors":"Yaqun Liu , Xujing Yang , Haowen Jiao","doi":"10.1016/j.vacuum.2025.114392","DOIUrl":null,"url":null,"abstract":"<div><div>This study investigates the microstructural evolution and creep behavior of additively manufactured Ti-22Al-25Nb intermetallic alloys under different post-processing conditions. Selective laser melting (SLM) was employed to fabricate samples, followed by two distinct heat treatments (HT1: 990°C-1h with water quenching + 800°C-2h with air cooling; HT2: hot isostatic pressing at 1200 °C/150 MPa + aging). Microstructural characterization revealed that the HT1-treated sample exhibited a semi-coherent B2/O interface structure with submicron pores and localized compositional segregation, resulting in interfacial dislocation pile-ups and stress concentrations. In contrast, the HIP-treated HT2 counterpart demonstrated fully coherent B2/O interfaces with negligible lattice mismatch (Δa/a <2 %) in a eutectic-like multi-phase configuration combining coarse O-phase plates and a refined B2 matrix, eliminating porosity and homogenizing phase distribution. Creep tests at 650 °C/150 MPa showed that the HT2 sample achieved a minimum creep rate of 6 × 10<sup>−5</sup> h<sup>−1</sup>, nearly three times lower than the HT1 one (1.7 × 10<sup>−4</sup> h<sup>−1</sup>) at identical conditions, due to the coherent interface-mediated dislocation glide and the suppressed cavity nucleation. The study highlights the critical role of interfacial coherency and defect elimination in enhancing high-temperature creep resistance, providing a microstructure-guided strategy for optimizing additively manufactured Ti<sub>2</sub>AlNb alloys for aerospace applications.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":"239 ","pages":"Article 114392"},"PeriodicalIF":3.8000,"publicationDate":"2025-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhancing high-temperature creep resistance of additively manufactured Ti2AlNb alloys via vacuum hot isostatic pressing-induced tailoring of coherent interfaces\",\"authors\":\"Yaqun Liu , Xujing Yang , Haowen Jiao\",\"doi\":\"10.1016/j.vacuum.2025.114392\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study investigates the microstructural evolution and creep behavior of additively manufactured Ti-22Al-25Nb intermetallic alloys under different post-processing conditions. Selective laser melting (SLM) was employed to fabricate samples, followed by two distinct heat treatments (HT1: 990°C-1h with water quenching + 800°C-2h with air cooling; HT2: hot isostatic pressing at 1200 °C/150 MPa + aging). Microstructural characterization revealed that the HT1-treated sample exhibited a semi-coherent B2/O interface structure with submicron pores and localized compositional segregation, resulting in interfacial dislocation pile-ups and stress concentrations. In contrast, the HIP-treated HT2 counterpart demonstrated fully coherent B2/O interfaces with negligible lattice mismatch (Δa/a <2 %) in a eutectic-like multi-phase configuration combining coarse O-phase plates and a refined B2 matrix, eliminating porosity and homogenizing phase distribution. Creep tests at 650 °C/150 MPa showed that the HT2 sample achieved a minimum creep rate of 6 × 10<sup>−5</sup> h<sup>−1</sup>, nearly three times lower than the HT1 one (1.7 × 10<sup>−4</sup> h<sup>−1</sup>) at identical conditions, due to the coherent interface-mediated dislocation glide and the suppressed cavity nucleation. The study highlights the critical role of interfacial coherency and defect elimination in enhancing high-temperature creep resistance, providing a microstructure-guided strategy for optimizing additively manufactured Ti<sub>2</sub>AlNb alloys for aerospace applications.</div></div>\",\"PeriodicalId\":23559,\"journal\":{\"name\":\"Vacuum\",\"volume\":\"239 \",\"pages\":\"Article 114392\"},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2025-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Vacuum\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0042207X25003823\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X25003823","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Enhancing high-temperature creep resistance of additively manufactured Ti2AlNb alloys via vacuum hot isostatic pressing-induced tailoring of coherent interfaces
This study investigates the microstructural evolution and creep behavior of additively manufactured Ti-22Al-25Nb intermetallic alloys under different post-processing conditions. Selective laser melting (SLM) was employed to fabricate samples, followed by two distinct heat treatments (HT1: 990°C-1h with water quenching + 800°C-2h with air cooling; HT2: hot isostatic pressing at 1200 °C/150 MPa + aging). Microstructural characterization revealed that the HT1-treated sample exhibited a semi-coherent B2/O interface structure with submicron pores and localized compositional segregation, resulting in interfacial dislocation pile-ups and stress concentrations. In contrast, the HIP-treated HT2 counterpart demonstrated fully coherent B2/O interfaces with negligible lattice mismatch (Δa/a <2 %) in a eutectic-like multi-phase configuration combining coarse O-phase plates and a refined B2 matrix, eliminating porosity and homogenizing phase distribution. Creep tests at 650 °C/150 MPa showed that the HT2 sample achieved a minimum creep rate of 6 × 10−5 h−1, nearly three times lower than the HT1 one (1.7 × 10−4 h−1) at identical conditions, due to the coherent interface-mediated dislocation glide and the suppressed cavity nucleation. The study highlights the critical role of interfacial coherency and defect elimination in enhancing high-temperature creep resistance, providing a microstructure-guided strategy for optimizing additively manufactured Ti2AlNb alloys for aerospace applications.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.