{"title":"旋转半导体实心球的分式热光伏时空非定域模型","authors":"Faisal Alsharif","doi":"10.1016/j.asej.2025.103461","DOIUrl":null,"url":null,"abstract":"<div><div>Spinning semiconductors are essential for advanced technologies such as thermoelectric devices, plasma processes for etching and deposition, and satellite navigation systems. However, their complex responses to heat, mechanical stress, and rotation remain inadequately captured by existing models, motivating this research to develop a more accurate framework for understanding these materials’ behavior, particularly under dynamic conditions. This study introduces a novel mathematical model to analyze plasma interactions, heat flow, and elastic responses in a rotating semiconductor sphere, such as silicon, subjected to thermal shock with a traction-free surface. The model builds on the Green-Naghdi Type III framework by incorporating a relaxation factor and the Moore-Gibson-Thompson equation for improved heat conduction modeling. Additionally, it employs spacetime nonlocality to account for size-dependent and memory effects, and the Atangana-Baleanu fractional derivative to capture intricate dynamic behavior. By solving the model using the Laplace transform technique, the research reveals the impact of rotation speed, nonlocality, and fractional derivatives on temperature, displacement, stress, and charge carrier distribution. Key contributions include the development of an advanced model that surpasses traditional approaches, the demonstration of smoother thermal gradients, reduced deformation, and more uniform stress and charge distributions for enhanced thermal management and mechanical stability. These findings offer practical insights for designing reliable semiconductor devices in nanoelectronics, optoelectronics, and microelectromechanical systems, addressing critical gaps in current research and advancing semiconductor technology.</div></div>","PeriodicalId":48648,"journal":{"name":"Ain Shams Engineering Journal","volume":"16 8","pages":"Article 103461"},"PeriodicalIF":6.0000,"publicationDate":"2025-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fractional thermophotovoltaic with spacetime nonlocality model for a rotating semiconductor solid sphere\",\"authors\":\"Faisal Alsharif\",\"doi\":\"10.1016/j.asej.2025.103461\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Spinning semiconductors are essential for advanced technologies such as thermoelectric devices, plasma processes for etching and deposition, and satellite navigation systems. However, their complex responses to heat, mechanical stress, and rotation remain inadequately captured by existing models, motivating this research to develop a more accurate framework for understanding these materials’ behavior, particularly under dynamic conditions. This study introduces a novel mathematical model to analyze plasma interactions, heat flow, and elastic responses in a rotating semiconductor sphere, such as silicon, subjected to thermal shock with a traction-free surface. The model builds on the Green-Naghdi Type III framework by incorporating a relaxation factor and the Moore-Gibson-Thompson equation for improved heat conduction modeling. Additionally, it employs spacetime nonlocality to account for size-dependent and memory effects, and the Atangana-Baleanu fractional derivative to capture intricate dynamic behavior. By solving the model using the Laplace transform technique, the research reveals the impact of rotation speed, nonlocality, and fractional derivatives on temperature, displacement, stress, and charge carrier distribution. Key contributions include the development of an advanced model that surpasses traditional approaches, the demonstration of smoother thermal gradients, reduced deformation, and more uniform stress and charge distributions for enhanced thermal management and mechanical stability. These findings offer practical insights for designing reliable semiconductor devices in nanoelectronics, optoelectronics, and microelectromechanical systems, addressing critical gaps in current research and advancing semiconductor technology.</div></div>\",\"PeriodicalId\":48648,\"journal\":{\"name\":\"Ain Shams Engineering Journal\",\"volume\":\"16 8\",\"pages\":\"Article 103461\"},\"PeriodicalIF\":6.0000,\"publicationDate\":\"2025-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ain Shams Engineering Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2090447925002023\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ain Shams Engineering Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2090447925002023","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
Fractional thermophotovoltaic with spacetime nonlocality model for a rotating semiconductor solid sphere
Spinning semiconductors are essential for advanced technologies such as thermoelectric devices, plasma processes for etching and deposition, and satellite navigation systems. However, their complex responses to heat, mechanical stress, and rotation remain inadequately captured by existing models, motivating this research to develop a more accurate framework for understanding these materials’ behavior, particularly under dynamic conditions. This study introduces a novel mathematical model to analyze plasma interactions, heat flow, and elastic responses in a rotating semiconductor sphere, such as silicon, subjected to thermal shock with a traction-free surface. The model builds on the Green-Naghdi Type III framework by incorporating a relaxation factor and the Moore-Gibson-Thompson equation for improved heat conduction modeling. Additionally, it employs spacetime nonlocality to account for size-dependent and memory effects, and the Atangana-Baleanu fractional derivative to capture intricate dynamic behavior. By solving the model using the Laplace transform technique, the research reveals the impact of rotation speed, nonlocality, and fractional derivatives on temperature, displacement, stress, and charge carrier distribution. Key contributions include the development of an advanced model that surpasses traditional approaches, the demonstration of smoother thermal gradients, reduced deformation, and more uniform stress and charge distributions for enhanced thermal management and mechanical stability. These findings offer practical insights for designing reliable semiconductor devices in nanoelectronics, optoelectronics, and microelectromechanical systems, addressing critical gaps in current research and advancing semiconductor technology.
期刊介绍:
in Shams Engineering Journal is an international journal devoted to publication of peer reviewed original high-quality research papers and review papers in both traditional topics and those of emerging science and technology. Areas of both theoretical and fundamental interest as well as those concerning industrial applications, emerging instrumental techniques and those which have some practical application to an aspect of human endeavor, such as the preservation of the environment, health, waste disposal are welcome. The overall focus is on original and rigorous scientific research results which have generic significance.
Ain Shams Engineering Journal focuses upon aspects of mechanical engineering, electrical engineering, civil engineering, chemical engineering, petroleum engineering, environmental engineering, architectural and urban planning engineering. Papers in which knowledge from other disciplines is integrated with engineering are especially welcome like nanotechnology, material sciences, and computational methods as well as applied basic sciences: engineering mathematics, physics and chemistry.