旋转半导体实心球的分式热光伏时空非定域模型

IF 6 2区 工程技术 Q1 ENGINEERING, MULTIDISCIPLINARY
Faisal Alsharif
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引用次数: 0

摘要

旋转半导体对于热电器件、等离子体蚀刻和沉积工艺以及卫星导航系统等先进技术至关重要。然而,它们对热、机械应力和旋转的复杂响应仍未被现有模型充分捕获,这促使本研究开发更准确的框架来理解这些材料的行为,特别是在动态条件下。本研究引入了一种新的数学模型来分析旋转半导体球体(如硅)在无牵引力表面热冲击下的等离子体相互作用、热流和弹性响应。该模型建立在Green-Naghdi III型框架的基础上,结合了松弛因子和摩尔-吉布森-汤普森方程,以改进热传导模型。此外,它采用时空非定域性来解释大小依赖和记忆效应,并使用Atangana-Baleanu分数导数来捕捉复杂的动态行为。利用拉普拉斯变换技术求解模型,揭示了转速、非定域性和分数阶导数对温度、位移、应力和载流子分布的影响。主要贡献包括开发了一种超越传统方法的先进模型,展示了更平滑的热梯度,减少变形,以及更均匀的应力和电荷分布,以增强热管理和机械稳定性。这些发现为在纳米电子学、光电子学和微机电系统中设计可靠的半导体器件提供了实用的见解,解决了当前研究中的关键空白,并推动了半导体技术的发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fractional thermophotovoltaic with spacetime nonlocality model for a rotating semiconductor solid sphere
Spinning semiconductors are essential for advanced technologies such as thermoelectric devices, plasma processes for etching and deposition, and satellite navigation systems. However, their complex responses to heat, mechanical stress, and rotation remain inadequately captured by existing models, motivating this research to develop a more accurate framework for understanding these materials’ behavior, particularly under dynamic conditions. This study introduces a novel mathematical model to analyze plasma interactions, heat flow, and elastic responses in a rotating semiconductor sphere, such as silicon, subjected to thermal shock with a traction-free surface. The model builds on the Green-Naghdi Type III framework by incorporating a relaxation factor and the Moore-Gibson-Thompson equation for improved heat conduction modeling. Additionally, it employs spacetime nonlocality to account for size-dependent and memory effects, and the Atangana-Baleanu fractional derivative to capture intricate dynamic behavior. By solving the model using the Laplace transform technique, the research reveals the impact of rotation speed, nonlocality, and fractional derivatives on temperature, displacement, stress, and charge carrier distribution. Key contributions include the development of an advanced model that surpasses traditional approaches, the demonstration of smoother thermal gradients, reduced deformation, and more uniform stress and charge distributions for enhanced thermal management and mechanical stability. These findings offer practical insights for designing reliable semiconductor devices in nanoelectronics, optoelectronics, and microelectromechanical systems, addressing critical gaps in current research and advancing semiconductor technology.
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来源期刊
Ain Shams Engineering Journal
Ain Shams Engineering Journal Engineering-General Engineering
CiteScore
10.80
自引率
13.30%
发文量
441
审稿时长
49 weeks
期刊介绍: in Shams Engineering Journal is an international journal devoted to publication of peer reviewed original high-quality research papers and review papers in both traditional topics and those of emerging science and technology. Areas of both theoretical and fundamental interest as well as those concerning industrial applications, emerging instrumental techniques and those which have some practical application to an aspect of human endeavor, such as the preservation of the environment, health, waste disposal are welcome. The overall focus is on original and rigorous scientific research results which have generic significance. Ain Shams Engineering Journal focuses upon aspects of mechanical engineering, electrical engineering, civil engineering, chemical engineering, petroleum engineering, environmental engineering, architectural and urban planning engineering. Papers in which knowledge from other disciplines is integrated with engineering are especially welcome like nanotechnology, material sciences, and computational methods as well as applied basic sciences: engineering mathematics, physics and chemistry.
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