Mikayla Stevens, Brian R Morrow, Anne E Hill, Craig Volk Vinall, Franklin Garcia-Godoy
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引用次数: 0
摘要
目的:研究氟化二胺银(SDF)对全蚀刻胶粘剂剪切粘接的影响。方法:收集30颗无龋的恒磨牙,切片,暴露牙本质,每颗牙2个样本。样品装在树脂中,粗化,压平至暴露的牙本质,并再水化(在37摄氏度下24小时)。15个样本随机分配到每个测试组(n = 15/gp): 3M™Scotchbond™Universal Plus Adhesive (SUPA), SDF+SUPA, Prime & Bond elect®Universal (PBE)和SDF+PBE。所有组均使用TPH Spectra®ST复合材料,在进行剪切粘合测试之前进行光固化和再水化(在37摄氏度下进行24小时)。采用双向方差分析和Holm-Sidak事后检验对最大应力数据进行统计学分析(结果:剪切应力(MPa)分别为:SUPA(26.5±3.0)、SDF+SUPA(25.6±7.2)、PBE(21.1±5.7)和SDF+PBE(21.7±5.7)。只有SUPA与PBE有统计学差异(P=0.012)。结论:在本研究范围内,氟化二胺银不影响树脂复合材料与牙本质的剪切结合。
Effects of 38 Percent Silver Diammine Fluoride on Adhesive Shear Bond Strength of Resin Composite to Permanent Dentin: A Preliminary Assessment.
Purpose: The purpose of this study was to evaluate the influence of silver diammine fluoride (SDF) on shear bonding with total-etch adhesives. Methods: Thirty non-carious permanent human molars were collected and sectioned, exposing dentin that yielded two samples per tooth. Samples were mounted in resin, roughened, flattened to exposed dentine, and rehydrated (for 24 hours at 37 degrees Celsius). Fifteen samples were randomly allocated to each test group (n equals 15/gp): 3M™ Scotchbond™ Universal Plus Adhesive (SUPA), SDF+SUPA, Prime & Bond elect® Universal (PBE), and SDF+PBE. TPH Spectra® ST composite was utilized in all groups, light-cured, and rehydrated (for 24 hours at 37 degrees Celsius) before shear bond testing was performed. Maximum stress data were statistically analyzed using a two-way analysis of variance and Holm-Sidak post-hoc test (P<0.05). Results: Shear stress (MPa) were: SUPA (26.5±3.0), SDF+SUPA (25.6±7.2), PBE (21.1±5.7), and SDF+PBE (21.7±5.7). Statistically significant differences were only noted between SUPA and PBE (P=0.012). Conclusion: Within the limitations of this study, silver diammine fluoride did not affect the shear bonding of resin composite to dentin.