完全耗尽绝缘体上硅晶圆的电学特性

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
A.K. Aladim
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引用次数: 0

摘要

全耗尽绝缘体上硅(FDSOI)衬底在下一代集成电路的发展中起着关键作用,为未来的电子技术铺平了道路。在12 nm厚硅膜和25 nm埋氧化物(BOX)膜的FDSOI晶圆表征中,电容和电导测量揭示了一种新的极化传播效应。这种效应发生在高偏置电压下,显著改变了FDSOI衬底的电学特性,可以通过RC传输线有效地模拟。测量还揭示了FDSOI衬底对各种外部因素的高灵敏度,如频率、激励信号幅度、光暴露和氧化栅厚度。在FDSOI结构上添加氧化栅也会在硅膜中引起量子限制效应,显著地改变器件的电学特性。这项研究对学术研究和工业界都很有兴趣,对下一代FDSOI衬底的理解和表征做出了重大的科学贡献。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical properties of fully depleted silicon-on-insulator wafers
Fully depleted silicon on insulator (FDSOI) substrates are playing a key role in the development of next-generation integrated circuits, paving the way for future electronic technologies. In the characterization of FDSOI wafers with a 12 nm thick silicon film and a 25 nm buried oxide (BOX) film, capacitance and conductance measurements have revealed a novel polarization propagation effect. This effect, which occurs under high bias voltages, significantly alters the electrical properties of FDSOI substrates and can be effectively modeled by an RC transmission line. The measurements also reveal the high sensitivity of FDSOI substrates to various external factors, such as frequency, excitation signal amplitude, light exposure, and oxide gate thickness. The addition of an oxide gate on FDSOI structures also induces quantum confinement effects in the silicon film, significantly modifying the electrical characteristics of the devices. This study, which is of interest to both academic research and industry, constitutes a major scientific contribution to the understanding and characterization of next-generation FDSOI substrates.
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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