{"title":"完全耗尽绝缘体上硅晶圆的电学特性","authors":"A.K. Aladim","doi":"10.1016/j.mejo.2025.106731","DOIUrl":null,"url":null,"abstract":"<div><div>Fully depleted silicon on insulator (FDSOI) substrates are playing a key role in the development of next-generation integrated circuits, paving the way for future electronic technologies. In the characterization of FDSOI wafers with a 12 nm thick silicon film and a 25 nm buried oxide (BOX) film, capacitance and conductance measurements have revealed a novel polarization propagation effect. This effect, which occurs under high bias voltages, significantly alters the electrical properties of FDSOI substrates and can be effectively modeled by an RC transmission line. The measurements also reveal the high sensitivity of FDSOI substrates to various external factors, such as frequency, excitation signal amplitude, light exposure, and oxide gate thickness. The addition of an oxide gate on FDSOI structures also induces quantum confinement effects in the silicon film, significantly modifying the electrical characteristics of the devices. This study, which is of interest to both academic research and industry, constitutes a major scientific contribution to the understanding and characterization of next-generation FDSOI substrates.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106731"},"PeriodicalIF":1.9000,"publicationDate":"2025-05-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical properties of fully depleted silicon-on-insulator wafers\",\"authors\":\"A.K. Aladim\",\"doi\":\"10.1016/j.mejo.2025.106731\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Fully depleted silicon on insulator (FDSOI) substrates are playing a key role in the development of next-generation integrated circuits, paving the way for future electronic technologies. In the characterization of FDSOI wafers with a 12 nm thick silicon film and a 25 nm buried oxide (BOX) film, capacitance and conductance measurements have revealed a novel polarization propagation effect. This effect, which occurs under high bias voltages, significantly alters the electrical properties of FDSOI substrates and can be effectively modeled by an RC transmission line. The measurements also reveal the high sensitivity of FDSOI substrates to various external factors, such as frequency, excitation signal amplitude, light exposure, and oxide gate thickness. The addition of an oxide gate on FDSOI structures also induces quantum confinement effects in the silicon film, significantly modifying the electrical characteristics of the devices. This study, which is of interest to both academic research and industry, constitutes a major scientific contribution to the understanding and characterization of next-generation FDSOI substrates.</div></div>\",\"PeriodicalId\":49818,\"journal\":{\"name\":\"Microelectronics Journal\",\"volume\":\"161 \",\"pages\":\"Article 106731\"},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2025-05-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1879239125001808\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125001808","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Electrical properties of fully depleted silicon-on-insulator wafers
Fully depleted silicon on insulator (FDSOI) substrates are playing a key role in the development of next-generation integrated circuits, paving the way for future electronic technologies. In the characterization of FDSOI wafers with a 12 nm thick silicon film and a 25 nm buried oxide (BOX) film, capacitance and conductance measurements have revealed a novel polarization propagation effect. This effect, which occurs under high bias voltages, significantly alters the electrical properties of FDSOI substrates and can be effectively modeled by an RC transmission line. The measurements also reveal the high sensitivity of FDSOI substrates to various external factors, such as frequency, excitation signal amplitude, light exposure, and oxide gate thickness. The addition of an oxide gate on FDSOI structures also induces quantum confinement effects in the silicon film, significantly modifying the electrical characteristics of the devices. This study, which is of interest to both academic research and industry, constitutes a major scientific contribution to the understanding and characterization of next-generation FDSOI substrates.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.