界面选择性对AlGaN/GaN FinFET多界面传热的影响

IF 6.1 2区 工程技术 Q2 ENERGY & FUELS
Baoyi Hu , Wenlong Bao , Zhaoliang Wang , Dawei Tang
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引用次数: 0

摘要

随着晶体管尺寸的不断缩小和功率密度的不断提高,热管理已成为现代电子器件中的一个关键挑战。特别是,热点的形成和界面热阻是限制高效散热的两个主要因素。虽然以前的研究分别研究了热点诱导的非平衡效应和界面声子散射,但局部热点与界面输运之间的耦合仍然没有得到充分的探讨。本研究的重点是AlGaN/GaN finfet及其内部界面,采用多温度模型(MTM)和玻尔兹曼输运方程(BTE)研究非平衡和弹道热输运机制。本文提出了一种新的比热阻分解方法,以定量地分离比热阻的内在、非平衡和弹道贡献,从而对声子输运行为有更机械的理解。我们的研究结果表明,热点的选择性激发和界面的选择性是导致非平衡和弹道效应的关键因素。具体来说,当Au/GaN界面优先传输低频声子时,热点主要激发高频声子。这种光谱失配抑制了界面传热,并且由于界面的选择性,热点的影响很少扩展到整个界面。值得注意的是,在靠近界面的位置,热点的影响在非平衡输运和弹道输运方面都明显减弱,突出了界面选择性在热点热输运中的关键作用。器件级模拟进一步表明,弹道输运阻碍了热点附近的散热,加剧了局部不平衡并提高了峰值温度。本文系统地分析了AlGaN/GaN FinFET中选择性激发和界面选择性之间的相互作用,并引入了一种新的分解方法来分离比热阻中的弹道和非平衡效应。这些见解为理解和调控纳米级场效应管的热输运提供了新的方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Influence of interfacial selectivity on heat transport at multi-interfaces in AlGaN/GaN FinFET

Influence of interfacial selectivity on heat transport at multi-interfaces in AlGaN/GaN FinFET
With continued transistor scaling and rising power densities, thermal management has become a critical challenge in modern electronic devices. In particular, hotspot formation and interfacial thermal resistance are two major factors limiting efficient heat dissipation. While previous studies have examined hotspot-induced nonequilibrium effects and interfacial phonon scattering separately, the coupling between localized hotspots and interfacial transport remains insufficiently explored. This study focuses on AlGaN/GaN FinFETs and their internal interfaces, employing the multitemperature model (MTM) and the Boltzmann transport equation (BTE) to investigate nonequilibrium and ballistic thermal transport mechanisms. A novel specific thermal resistance decomposition method is developed to quantitatively separate intrinsic, nonequilibrium, and ballistic contributions to specific thermal resistance, enabling a more mechanistic understanding of phonon transport behavior. Our results reveal that the selective excitation of hotspots and the interfacial selectivity are key contributors to nonequilibrium and ballistic effects. Specifically, while the Au/GaN interface preferentially transmits low-frequency phonons, hotspots predominantly excite high-frequency phonons. This spectral mismatch suppresses interfacial heat transfer, and due to interfacial selectivity, the influence of hotspots seldom extends across the interface. Notably, at locations near the interface, the influence of the hotspot is significantly weakened, both in terms of nonequilibrium transport and ballistic transport, highlighting the critical role of interfacial selectivity in hotspot thermal transport. Device-level simulations further demonstrate that ballistic transport impedes heat dissipation near the hotspot, exacerbating local nonequilibrium and elevating peak temperatures. This work systematically analyzes the interplay between selective excitation and interfacial selectivity in the AlGaN/GaN FinFET, and introduce a novel decomposition methodology to isolate ballistic and nonequilibrium effects in specific thermal resistance. These insights offer a new direction for understanding and regulating thermal transport in nanoscale FETs.
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来源期刊
Applied Thermal Engineering
Applied Thermal Engineering 工程技术-工程:机械
CiteScore
11.30
自引率
15.60%
发文量
1474
审稿时长
57 days
期刊介绍: Applied Thermal Engineering disseminates novel research related to the design, development and demonstration of components, devices, equipment, technologies and systems involving thermal processes for the production, storage, utilization and conservation of energy, with a focus on engineering application. The journal publishes high-quality and high-impact Original Research Articles, Review Articles, Short Communications and Letters to the Editor on cutting-edge innovations in research, and recent advances or issues of interest to the thermal engineering community.
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