Yan Zhou , Yingqi Chen , Haohao Wang , Guoxiang Wang
{"title":"利用多层结构对bi2te3基薄膜的热电参数进行解耦","authors":"Yan Zhou , Yingqi Chen , Haohao Wang , Guoxiang Wang","doi":"10.1016/j.pnsc.2025.01.003","DOIUrl":null,"url":null,"abstract":"<div><div>Highly conductive metal layers Cr and Al are introduced to prepare multilayer thermoelectric films of Bi<sub>2</sub>Te<sub>3</sub>/Al and Bi<sub>2</sub>Te<sub>3</sub>/Cr. XRD precipitations and Raman bonding reveal the interfacial stability between the Bi<sub>2</sub>Te<sub>3</sub> and Al layers. The multilayer structure's interfacial effect breaks the coupling between the electrical conductivity and the Seebeck coefficient, both of which exhibit a steady upward trend as temperature rises. This directly contributes to the high power factor of 520.8 μW/mK<sup>2</sup> for Bi<sub>2</sub>Te<sub>3</sub>/Al that is produced at 600 K. On the other hand, Bi<sub>2</sub>Te<sub>3</sub> tends to react with Cr as temperature rises, and at 600 K, the optimal carrier concentration following interdiffusion results in a maximum PF of 199.0 μW/mK<sup>2</sup>. By comparison, they are both almost six times and two times better than pure Bi<sub>2</sub>Te<sub>3</sub>, respectively. Overall, this work improves Bi<sub>2</sub>Te<sub>3</sub> by introducing the metals Al and Cr with constructing a multilayer structure. It also offers a straightforward and user-friendly method for utilizing interfacial engineering to optimize the thermoelectric properties of thin films.</div></div>","PeriodicalId":20742,"journal":{"name":"Progress in Natural Science: Materials International","volume":"35 2","pages":"Pages 296-301"},"PeriodicalIF":7.1000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Decoupling opposed thermoelectric parameters via multilayer structure in Bi2Te3-based films\",\"authors\":\"Yan Zhou , Yingqi Chen , Haohao Wang , Guoxiang Wang\",\"doi\":\"10.1016/j.pnsc.2025.01.003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Highly conductive metal layers Cr and Al are introduced to prepare multilayer thermoelectric films of Bi<sub>2</sub>Te<sub>3</sub>/Al and Bi<sub>2</sub>Te<sub>3</sub>/Cr. XRD precipitations and Raman bonding reveal the interfacial stability between the Bi<sub>2</sub>Te<sub>3</sub> and Al layers. The multilayer structure's interfacial effect breaks the coupling between the electrical conductivity and the Seebeck coefficient, both of which exhibit a steady upward trend as temperature rises. This directly contributes to the high power factor of 520.8 μW/mK<sup>2</sup> for Bi<sub>2</sub>Te<sub>3</sub>/Al that is produced at 600 K. On the other hand, Bi<sub>2</sub>Te<sub>3</sub> tends to react with Cr as temperature rises, and at 600 K, the optimal carrier concentration following interdiffusion results in a maximum PF of 199.0 μW/mK<sup>2</sup>. By comparison, they are both almost six times and two times better than pure Bi<sub>2</sub>Te<sub>3</sub>, respectively. Overall, this work improves Bi<sub>2</sub>Te<sub>3</sub> by introducing the metals Al and Cr with constructing a multilayer structure. It also offers a straightforward and user-friendly method for utilizing interfacial engineering to optimize the thermoelectric properties of thin films.</div></div>\",\"PeriodicalId\":20742,\"journal\":{\"name\":\"Progress in Natural Science: Materials International\",\"volume\":\"35 2\",\"pages\":\"Pages 296-301\"},\"PeriodicalIF\":7.1000,\"publicationDate\":\"2025-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Progress in Natural Science: Materials International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1002007125000036\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Progress in Natural Science: Materials International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1002007125000036","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Decoupling opposed thermoelectric parameters via multilayer structure in Bi2Te3-based films
Highly conductive metal layers Cr and Al are introduced to prepare multilayer thermoelectric films of Bi2Te3/Al and Bi2Te3/Cr. XRD precipitations and Raman bonding reveal the interfacial stability between the Bi2Te3 and Al layers. The multilayer structure's interfacial effect breaks the coupling between the electrical conductivity and the Seebeck coefficient, both of which exhibit a steady upward trend as temperature rises. This directly contributes to the high power factor of 520.8 μW/mK2 for Bi2Te3/Al that is produced at 600 K. On the other hand, Bi2Te3 tends to react with Cr as temperature rises, and at 600 K, the optimal carrier concentration following interdiffusion results in a maximum PF of 199.0 μW/mK2. By comparison, they are both almost six times and two times better than pure Bi2Te3, respectively. Overall, this work improves Bi2Te3 by introducing the metals Al and Cr with constructing a multilayer structure. It also offers a straightforward and user-friendly method for utilizing interfacial engineering to optimize the thermoelectric properties of thin films.
期刊介绍:
Progress in Natural Science: Materials International provides scientists and engineers throughout the world with a central vehicle for the exchange and dissemination of basic theoretical studies and applied research of advanced materials. The emphasis is placed on original research, both analytical and experimental, which is of permanent interest to engineers and scientists, covering all aspects of new materials and technologies, such as, energy and environmental materials; advanced structural materials; advanced transportation materials, functional and electronic materials; nano-scale and amorphous materials; health and biological materials; materials modeling and simulation; materials characterization; and so on. The latest research achievements and innovative papers in basic theoretical studies and applied research of material science will be carefully selected and promptly reported. Thus, the aim of this Journal is to serve the global materials science and technology community with the latest research findings.
As a service to readers, an international bibliography of recent publications in advanced materials is published bimonthly.