Flow distribution regulation in microchannels for emitter side-mounted ionic wind heat sink and its implication for high-efficiency thermal management

The escalating demand for miniaturized and high-performance electronic devices has led to a substantial surge in the heat generation rate, which poses a significant threat to the stability and reliability of electronic components. Conventional cooling technologies are now confronted with formidable challenges. In this study, an ionic wind heat sink (IWHS) was developed by positioning wire electrodes parallel to the fin channels. The key innovation lies in the strategic rearrangement of the emitters, which effectively modifies the flow distribution of the mixed flow, thereby enhancing the cooling efficiency. A comprehensive approach integrating experimental investigations and numerical simulations was adopted. Regarding material selection, the results indicate that it exerts a substantial impact on both the cooling performance and the heat transfer efficiency per unit mass of the IWHS. The primary structural parameters of the IWHS play a crucial role in determining its cooling capacity and the flow distribution of the mixed flow. The discharge gap affects the gas flow intensity through two main mechanisms. It weakens the body force acting on charged particles. It reduces the mean electric field intensity around the wire electrodes, leading to a decrease in the gas flow intensity. The flow speed drops due to wall friction within the fin channels and the loss of acceleration downstream. The combination of ionic wind and low-velocity incoming flow can remarkably increase the heat transfer coefficient and reduce the thermal resistance. The parallel side-placement design cuts down the momentum loss by 28%. The insulation wall isolation technology suppresses 93% of the potential interference between electrodes. This design offers a novel thermal management solution for micro-electronic devices, enabling a 40% reduction in volume and a three-fold increase in the energy efficiency ratio.