{"title":"自然对流条件下分支辐射式散热片的最佳管肋间距","authors":"Trailokya Lochan Tripathy, Sukanta Kumar Dash","doi":"10.1016/j.ijthermalsci.2025.109973","DOIUrl":null,"url":null,"abstract":"<div><div>The performance of Light Emitting Diodes (LEDs) experiences a significant degradation at elevated temperatures due to inefficient heat dissipation. Passive heat sinks, such as fins, are an effective solution for managing the heat generated by LEDs. The design of fins is critical for ensuring high rates of heat removal as well as lower mass. This study conducts a numerical investigation of radial heat sinks with branching pin fins under natural convection. The primary objective is to obtain an optimum design of the branching pin fins. A parametric study is conducted to observe the effect of fin height (15 mm <span><math><mrow><mo><</mo><mi>H</mi><mo><</mo></mrow></math></span> 30 mm), fin number (<span><math><mrow><mn>5</mn><mo><</mo><mi>n</mi><mo><</mo><mn>20</mn></mrow></math></span>), and pin-fin spacing (<span><math><mrow><mn>2</mn><mspace></mspace><mtext>mm</mtext><mo><</mo><msub><mi>L</mi><mi>s</mi></msub><mo><</mo><mn>10</mn><mspace></mspace><mtext>mm</mtext></mrow></math></span>) on the heat transfer performance of the heat sink arrays. A heat transfer enhancement factor based on the thermal resistance and mass of the heat sink is used to calculate the increase in the heat transfer performance of the current design over the branching plate fin radial heat sinks. Due to the branching pin fins, the mass of the heat sinks reduces by 23 %–33 % for fin heights of 15 mm and 30 mm while providing similar thermal performance as branching plate-fin heat sinks. From the current study, an optimum pin-fin spacing of 4 mm yields the lowest mass and thermal resistance among the other pin fin-spacings for fin arrays with <span><math><mrow><mi>n</mi><mo>></mo><mn>20</mn></mrow></math></span> and <span><math><mrow><mi>H</mi><mo>=</mo><mn>21.3</mn></mrow></math></span> mm.</div></div>","PeriodicalId":341,"journal":{"name":"International Journal of Thermal Sciences","volume":"215 ","pages":"Article 109973"},"PeriodicalIF":4.9000,"publicationDate":"2025-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimum pin-fin spacing of branching radial heat sinks under natural convection for LED cooling\",\"authors\":\"Trailokya Lochan Tripathy, Sukanta Kumar Dash\",\"doi\":\"10.1016/j.ijthermalsci.2025.109973\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The performance of Light Emitting Diodes (LEDs) experiences a significant degradation at elevated temperatures due to inefficient heat dissipation. Passive heat sinks, such as fins, are an effective solution for managing the heat generated by LEDs. The design of fins is critical for ensuring high rates of heat removal as well as lower mass. This study conducts a numerical investigation of radial heat sinks with branching pin fins under natural convection. The primary objective is to obtain an optimum design of the branching pin fins. A parametric study is conducted to observe the effect of fin height (15 mm <span><math><mrow><mo><</mo><mi>H</mi><mo><</mo></mrow></math></span> 30 mm), fin number (<span><math><mrow><mn>5</mn><mo><</mo><mi>n</mi><mo><</mo><mn>20</mn></mrow></math></span>), and pin-fin spacing (<span><math><mrow><mn>2</mn><mspace></mspace><mtext>mm</mtext><mo><</mo><msub><mi>L</mi><mi>s</mi></msub><mo><</mo><mn>10</mn><mspace></mspace><mtext>mm</mtext></mrow></math></span>) on the heat transfer performance of the heat sink arrays. A heat transfer enhancement factor based on the thermal resistance and mass of the heat sink is used to calculate the increase in the heat transfer performance of the current design over the branching plate fin radial heat sinks. Due to the branching pin fins, the mass of the heat sinks reduces by 23 %–33 % for fin heights of 15 mm and 30 mm while providing similar thermal performance as branching plate-fin heat sinks. From the current study, an optimum pin-fin spacing of 4 mm yields the lowest mass and thermal resistance among the other pin fin-spacings for fin arrays with <span><math><mrow><mi>n</mi><mo>></mo><mn>20</mn></mrow></math></span> and <span><math><mrow><mi>H</mi><mo>=</mo><mn>21.3</mn></mrow></math></span> mm.</div></div>\",\"PeriodicalId\":341,\"journal\":{\"name\":\"International Journal of Thermal Sciences\",\"volume\":\"215 \",\"pages\":\"Article 109973\"},\"PeriodicalIF\":4.9000,\"publicationDate\":\"2025-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Thermal Sciences\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1290072925002960\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Thermal Sciences","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1290072925002960","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Optimum pin-fin spacing of branching radial heat sinks under natural convection for LED cooling
The performance of Light Emitting Diodes (LEDs) experiences a significant degradation at elevated temperatures due to inefficient heat dissipation. Passive heat sinks, such as fins, are an effective solution for managing the heat generated by LEDs. The design of fins is critical for ensuring high rates of heat removal as well as lower mass. This study conducts a numerical investigation of radial heat sinks with branching pin fins under natural convection. The primary objective is to obtain an optimum design of the branching pin fins. A parametric study is conducted to observe the effect of fin height (15 mm 30 mm), fin number (), and pin-fin spacing () on the heat transfer performance of the heat sink arrays. A heat transfer enhancement factor based on the thermal resistance and mass of the heat sink is used to calculate the increase in the heat transfer performance of the current design over the branching plate fin radial heat sinks. Due to the branching pin fins, the mass of the heat sinks reduces by 23 %–33 % for fin heights of 15 mm and 30 mm while providing similar thermal performance as branching plate-fin heat sinks. From the current study, an optimum pin-fin spacing of 4 mm yields the lowest mass and thermal resistance among the other pin fin-spacings for fin arrays with and mm.
期刊介绍:
The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review.
The fundamental subjects considered within the scope of the journal are:
* Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow
* Forced, natural or mixed convection in reactive or non-reactive media
* Single or multi–phase fluid flow with or without phase change
* Near–and far–field radiative heat transfer
* Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...)
* Multiscale modelling
The applied research topics include:
* Heat exchangers, heat pipes, cooling processes
* Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries)
* Nano–and micro–technology for energy, space, biosystems and devices
* Heat transport analysis in advanced systems
* Impact of energy–related processes on environment, and emerging energy systems
The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.