Bi-objective optimization of thermal interface material-microchannel-nanofluid-based thermal management system design for microchip array

As the power consumption of Active Antenna Unit (AAU) increases, effective thermal management is essential to ensuring stable equipment operation. Among various solutions, microchannel liquid cooling using nanofluid offers notable potential, yet system-level studies on its integration remain limited. This study develops a microchip array thermal management system based on thermal interface material, microchannel, and nanofluid. A semi-empirical steady-state heat transfer model is combined with an economic model to establish a bi-objective optimization framework. This framework enables a trade-off optimization that balances cooling performance and economic efficiency. Sensitivity analysis is conducted to evaluate the influence of key design parameters, and case studies under different operating scenarios are used to validate system’s reliability. Results indicate that the trade-off design achieves a weighted average chip junction temperature of 53.3 °C with a total annualized cost of $45.7. The study concludes that optimizing the structural design and cost of the air-cooled heat sink, along with reducing pump and fan power, is key to achieving efficient and cost-effective thermal management.