热压烧结制备Ag-SnO2(CuO)/Cu-SnO2（CuO）非均相材料的电接触性能

IF 5.1 2区材料科学 Q1 MATERIALS SCIENCE, CERAMICS

Ceramics International Pub Date : 2025-05-01 DOI:10.1016/j.ceramint.2025.01.507

Wenjie Feng , Huanchong Lu , Guijing Li

{"title":"热压烧结制备Ag-SnO2(CuO)/Cu-SnO2（CuO）非均相材料的电接触性能","authors":"Wenjie Feng , Huanchong Lu , Guijing Li","doi":"10.1016/j.ceramint.2025.01.507","DOIUrl":null,"url":null,"abstract":"<div><div>New Ag-SnO2(CuO)/Cu-SnO2(CuO) heterogeneous materials (HMs) were prepared by a powder metallurgy method for use as high-performance and low-cost electrical contacts. The Ag-SnO2(CuO) components of the HMs was used as contacts and the Cu-SnO2(CuO) components served as conductors. The electrical contact properties of the HMs were tested and analyzed. The results showed that vacuum hot-press sintering near the Ag-Cu eutectic point temperature could suppress the aggregation of SnO2 particles at the Ag/Cu interface and enhance the interfacial bond strength of the HMs. The Ag-SnO2(CuO)/Cu-SnO2(CuO) HMs exhibited excellent electrical contact properties compared with that of a conventional Ag-SnO2(CuO) composite material. In particular, the welding force of the HM contacts was about 1 cN, which was much lower than that of the Ag-SnO2(CuO) contacts. The HM contacts showed low and stable contact resistance in the range of 6–20 mΩ. In contrast, when the Cu-SnO2(CuO) components in the HMs acted as electrical contacts, the contact resistance sharply increased to about 0.3 MΩ after 27 operations due to the oxidation of Cu in air, an increase of millions or even tens of millions of times. Through comparative analysis, it was inferred that the excellent electrical contact properties of the Ag-SnO2(CuO)/Cu-SnO2(CuO) HMs were mainly attributed to the good arc dispersion effect and oxidation resistance.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"51 13","pages":"Pages 17341-17354"},"PeriodicalIF":5.1000,"publicationDate":"2025-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical contact performances of Ag-SnO2(CuO)/Cu-SnO2(CuO) heterogeneous materials prepared by hot-press sintering\",\"authors\":\"Wenjie Feng , Huanchong Lu , Guijing Li\",\"doi\":\"10.1016/j.ceramint.2025.01.507\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>New Ag-SnO2(CuO)/Cu-SnO2(CuO) heterogeneous materials (HMs) were prepared by a powder metallurgy method for use as high-performance and low-cost electrical contacts. The Ag-SnO2(CuO) components of the HMs was used as contacts and the Cu-SnO2(CuO) components served as conductors. The electrical contact properties of the HMs were tested and analyzed. The results showed that vacuum hot-press sintering near the Ag-Cu eutectic point temperature could suppress the aggregation of SnO2 particles at the Ag/Cu interface and enhance the interfacial bond strength of the HMs. The Ag-SnO2(CuO)/Cu-SnO2(CuO) HMs exhibited excellent electrical contact properties compared with that of a conventional Ag-SnO2(CuO) composite material. In particular, the welding force of the HM contacts was about 1 cN, which was much lower than that of the Ag-SnO2(CuO) contacts. The HM contacts showed low and stable contact resistance in the range of 6–20 mΩ. In contrast, when the Cu-SnO2(CuO) components in the HMs acted as electrical contacts, the contact resistance sharply increased to about 0.3 MΩ after 27 operations due to the oxidation of Cu in air, an increase of millions or even tens of millions of times. Through comparative analysis, it was inferred that the excellent electrical contact properties of the Ag-SnO2(CuO)/Cu-SnO2(CuO) HMs were mainly attributed to the good arc dispersion effect and oxidation resistance.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"51 13\",\"pages\":\"Pages 17341-17354\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2025-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0272884225005644\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0272884225005644","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}

引用次数: 0

摘要

采用粉末冶金法制备了新型Ag-SnO2(CuO)/Cu-SnO2（CuO）非均相材料（HMs）作为高性能、低成本的电触点。其中Ag-SnO2（CuO）组分作为触点，Cu-SnO2（CuO）组分作为导体。并对其电接触性能进行了测试和分析。结果表明，在Ag-Cu共晶点温度附近进行真空热压烧结可以抑制SnO2颗粒在Ag/Cu界面的聚集，提高HMs的界面结合强度。与传统的Ag-SnO2（CuO）复合材料相比，Ag-SnO2(CuO)/Cu-SnO2(CuO) HMs具有优异的电接触性能。其中HM触点的焊接力约为1 cN，远低于Ag-SnO2（CuO）触点的焊接力。HM触点在6-20 mΩ范围内表现出低而稳定的接触电阻。而当hm中的Cu- sno2 （CuO）组分作为电触点时，由于Cu在空气中的氧化作用，经过27次操作后，触点电阻急剧增加到0.3 MΩ左右，增加了数百万甚至数千万倍。通过对比分析，推断Ag-SnO2(CuO)/Cu-SnO2(CuO) HMs优异的电接触性能主要归功于良好的电弧分散效果和抗氧化性。

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Electrical contact performances of Ag-SnO2(CuO)/Cu-SnO2(CuO) heterogeneous materials prepared by hot-press sintering

New Ag-SnO₂(CuO)/Cu-SnO₂(CuO) heterogeneous materials (HMs) were prepared by a powder metallurgy method for use as high-performance and low-cost electrical contacts. The Ag-SnO₂(CuO) components of the HMs was used as contacts and the Cu-SnO₂(CuO) components served as conductors. The electrical contact properties of the HMs were tested and analyzed. The results showed that vacuum hot-press sintering near the Ag-Cu eutectic point temperature could suppress the aggregation of SnO₂ particles at the Ag/Cu interface and enhance the interfacial bond strength of the HMs. The Ag-SnO₂(CuO)/Cu-SnO₂(CuO) HMs exhibited excellent electrical contact properties compared with that of a conventional Ag-SnO₂(CuO) composite material. In particular, the welding force of the HM contacts was about 1 cN, which was much lower than that of the Ag-SnO₂(CuO) contacts. The HM contacts showed low and stable contact resistance in the range of 6–20 mΩ. In contrast, when the Cu-SnO₂(CuO) components in the HMs acted as electrical contacts, the contact resistance sharply increased to about 0.3 MΩ after 27 operations due to the oxidation of Cu in air, an increase of millions or even tens of millions of times. Through comparative analysis, it was inferred that the excellent electrical contact properties of the Ag-SnO₂(CuO)/Cu-SnO₂(CuO) HMs were mainly attributed to the good arc dispersion effect and oxidation resistance.

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来源期刊

Ceramics International 工程技术-材料科学：硅酸盐

CiteScore

9.40

自引率

15.40%

发文量

4558

审稿时长

25 days

期刊介绍： Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.