Yuxiang Qiu , Qiaolei Li , Jingjing Liang , Boyang Qu , Xinzhi Liang , Shengqi Liu , Yizhou Zhou , Xiaofeng Sun , Jinguo Li
{"title":"立体光刻3D打印陶瓷的烧结动力学控制和抗热震性","authors":"Yuxiang Qiu , Qiaolei Li , Jingjing Liang , Boyang Qu , Xinzhi Liang , Shengqi Liu , Yizhou Zhou , Xiaofeng Sun , Jinguo Li","doi":"10.1016/j.ceramint.2025.01.518","DOIUrl":null,"url":null,"abstract":"<div><div>Stereolithography has had a transformative impact on the production of complex Al<sub>2</sub>O<sub>3</sub> ceramic components. However, the high melting point and inherent brittleness of Al<sub>2</sub>O<sub>3</sub> ceramics limit its application in the aerospace field. In this research, we investigated the influence on the microstructure, physical properties, mechanical properties, and thermal shock resistance (TSR) properties of the addition of TiO<sub>2</sub>-doped Al<sub>2</sub>O<sub>3</sub> ceramics by stereolithography 3D printing technology. This work revealed the relationship between the addition of TiO<sub>2</sub> and the sintering kinetics of Al<sub>2</sub>O<sub>3</sub> ceramics. TiO<sub>2</sub> forms Al<sub>2</sub>TiO<sub>5</sub> with Al<sub>2</sub>O<sub>3</sub> at high temperatures, which promoted the growth of ceramic grains, increased the bulk density, reduced the porosity, and improved the flexural properties of Al<sub>2</sub>O<sub>3</sub> ceramics. During the cooling step of the sintering process, the anisotropy of thermal expansion coefficients of Al<sub>2</sub>TiO<sub>5</sub> and the difference in thermal expansion coefficients between the different phases (Al<sub>2</sub>O<sub>3</sub> and Al<sub>2</sub>TiO<sub>5</sub>) generate thermal stresses which ultimately cause microcracks in the low strength Al<sub>2</sub>TiO<sub>5</sub>. The presence of microcracks within the Al<sub>2</sub>TiO<sub>5</sub> causes thermal cracks to deflect during expansion, which passivated the crack tip effect. And TiO<sub>2</sub> promoted Al<sub>2</sub>O<sub>3</sub> sintering to raise the critical value of crack tip stress. Both mechanisms can improve the residual flexural strength of Al<sub>2</sub>O<sub>3</sub> ceramics, thereby improving TSR. Overall, the critical flexural strength of 2 wt% TiO<sub>2</sub>/Al<sub>2</sub>O<sub>3</sub> was the highest, reaching 165.158 MPa, and the corresponding critical thermal shock temperature difference was 264.10 °C. Based on the above study, samples with high TSR had been successfully produced using stereolithography 3D printing technology, which will promote the application of Al<sub>2</sub>O<sub>3</sub> ceramics in the aerospace field.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"51 13","pages":"Pages 17453-17462"},"PeriodicalIF":5.1000,"publicationDate":"2025-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Control of sintering kinetics and thermal shock resistance for stereolithography 3D printed ceramics\",\"authors\":\"Yuxiang Qiu , Qiaolei Li , Jingjing Liang , Boyang Qu , Xinzhi Liang , Shengqi Liu , Yizhou Zhou , Xiaofeng Sun , Jinguo Li\",\"doi\":\"10.1016/j.ceramint.2025.01.518\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Stereolithography has had a transformative impact on the production of complex Al<sub>2</sub>O<sub>3</sub> ceramic components. However, the high melting point and inherent brittleness of Al<sub>2</sub>O<sub>3</sub> ceramics limit its application in the aerospace field. In this research, we investigated the influence on the microstructure, physical properties, mechanical properties, and thermal shock resistance (TSR) properties of the addition of TiO<sub>2</sub>-doped Al<sub>2</sub>O<sub>3</sub> ceramics by stereolithography 3D printing technology. This work revealed the relationship between the addition of TiO<sub>2</sub> and the sintering kinetics of Al<sub>2</sub>O<sub>3</sub> ceramics. TiO<sub>2</sub> forms Al<sub>2</sub>TiO<sub>5</sub> with Al<sub>2</sub>O<sub>3</sub> at high temperatures, which promoted the growth of ceramic grains, increased the bulk density, reduced the porosity, and improved the flexural properties of Al<sub>2</sub>O<sub>3</sub> ceramics. During the cooling step of the sintering process, the anisotropy of thermal expansion coefficients of Al<sub>2</sub>TiO<sub>5</sub> and the difference in thermal expansion coefficients between the different phases (Al<sub>2</sub>O<sub>3</sub> and Al<sub>2</sub>TiO<sub>5</sub>) generate thermal stresses which ultimately cause microcracks in the low strength Al<sub>2</sub>TiO<sub>5</sub>. The presence of microcracks within the Al<sub>2</sub>TiO<sub>5</sub> causes thermal cracks to deflect during expansion, which passivated the crack tip effect. And TiO<sub>2</sub> promoted Al<sub>2</sub>O<sub>3</sub> sintering to raise the critical value of crack tip stress. Both mechanisms can improve the residual flexural strength of Al<sub>2</sub>O<sub>3</sub> ceramics, thereby improving TSR. Overall, the critical flexural strength of 2 wt% TiO<sub>2</sub>/Al<sub>2</sub>O<sub>3</sub> was the highest, reaching 165.158 MPa, and the corresponding critical thermal shock temperature difference was 264.10 °C. Based on the above study, samples with high TSR had been successfully produced using stereolithography 3D printing technology, which will promote the application of Al<sub>2</sub>O<sub>3</sub> ceramics in the aerospace field.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"51 13\",\"pages\":\"Pages 17453-17462\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2025-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0272884225005760\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0272884225005760","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
Control of sintering kinetics and thermal shock resistance for stereolithography 3D printed ceramics
Stereolithography has had a transformative impact on the production of complex Al2O3 ceramic components. However, the high melting point and inherent brittleness of Al2O3 ceramics limit its application in the aerospace field. In this research, we investigated the influence on the microstructure, physical properties, mechanical properties, and thermal shock resistance (TSR) properties of the addition of TiO2-doped Al2O3 ceramics by stereolithography 3D printing technology. This work revealed the relationship between the addition of TiO2 and the sintering kinetics of Al2O3 ceramics. TiO2 forms Al2TiO5 with Al2O3 at high temperatures, which promoted the growth of ceramic grains, increased the bulk density, reduced the porosity, and improved the flexural properties of Al2O3 ceramics. During the cooling step of the sintering process, the anisotropy of thermal expansion coefficients of Al2TiO5 and the difference in thermal expansion coefficients between the different phases (Al2O3 and Al2TiO5) generate thermal stresses which ultimately cause microcracks in the low strength Al2TiO5. The presence of microcracks within the Al2TiO5 causes thermal cracks to deflect during expansion, which passivated the crack tip effect. And TiO2 promoted Al2O3 sintering to raise the critical value of crack tip stress. Both mechanisms can improve the residual flexural strength of Al2O3 ceramics, thereby improving TSR. Overall, the critical flexural strength of 2 wt% TiO2/Al2O3 was the highest, reaching 165.158 MPa, and the corresponding critical thermal shock temperature difference was 264.10 °C. Based on the above study, samples with high TSR had been successfully produced using stereolithography 3D printing technology, which will promote the application of Al2O3 ceramics in the aerospace field.
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.