Xiaoqian Xue , Fugang Lu , Jia Yang , Yibo Fu , Tong Wu , Qiuguang Zhang , Ce Wang , Yongkang Dong , Panpan Lin , Tiesong Lin , Peng He
{"title":"反应结合碳化硅(RBSiC)钎焊Si-Ti共晶合金的显微组织和力学性能","authors":"Xiaoqian Xue , Fugang Lu , Jia Yang , Yibo Fu , Tong Wu , Qiuguang Zhang , Ce Wang , Yongkang Dong , Panpan Lin , Tiesong Lin , Peng He","doi":"10.1016/j.ceramint.2025.01.490","DOIUrl":null,"url":null,"abstract":"<div><div>The self-joining of Reaction-Bonded Silicon Carbide (RBSiC) was achieved using a Si-Ti eutectic alloy via vacuum brazing, offering a novel approach for high-performance SiC component integration. This study provides a comprehensive investigation into the wetting behavior of the Si-Ti eutectic on RBSiC, coupled with a detailed analysis of how brazing temperature influences joint microstructure, mechanical properties, and fracture morphology. The Si-Ti eutectic alloy exhibits an exceptionally low contact angle of 15° on the RBSiC surface, indicating superior wettability and spreading characteristics critical for robust bonding. The joints were primarily formed through atomic-scale interactions, with no new intermetallic compounds generated, ensuring the long-term stability of the interface. Brazing at 1375 °C for 15 min resulted in a shear strength of 154 MPa, with fracture occurring at the substrate, highlighting the excellent mechanical properties of the joints. The evolution of the joint microstructure and the underlying strengthening mechanisms were elucidated, providing insights into the intrinsic behavior of the bonding process. This pressureless joining technique paves the way for broader applications of high-performance SiC components, particularly in industries demanding advanced material integrity and reliability.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"51 13","pages":"Pages 17162-17171"},"PeriodicalIF":5.1000,"publicationDate":"2025-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructural and mechanical properties of reaction-bonded silicon carbide (RBSiC) brazed with Si-Ti eutectic alloy\",\"authors\":\"Xiaoqian Xue , Fugang Lu , Jia Yang , Yibo Fu , Tong Wu , Qiuguang Zhang , Ce Wang , Yongkang Dong , Panpan Lin , Tiesong Lin , Peng He\",\"doi\":\"10.1016/j.ceramint.2025.01.490\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The self-joining of Reaction-Bonded Silicon Carbide (RBSiC) was achieved using a Si-Ti eutectic alloy via vacuum brazing, offering a novel approach for high-performance SiC component integration. This study provides a comprehensive investigation into the wetting behavior of the Si-Ti eutectic on RBSiC, coupled with a detailed analysis of how brazing temperature influences joint microstructure, mechanical properties, and fracture morphology. The Si-Ti eutectic alloy exhibits an exceptionally low contact angle of 15° on the RBSiC surface, indicating superior wettability and spreading characteristics critical for robust bonding. The joints were primarily formed through atomic-scale interactions, with no new intermetallic compounds generated, ensuring the long-term stability of the interface. Brazing at 1375 °C for 15 min resulted in a shear strength of 154 MPa, with fracture occurring at the substrate, highlighting the excellent mechanical properties of the joints. The evolution of the joint microstructure and the underlying strengthening mechanisms were elucidated, providing insights into the intrinsic behavior of the bonding process. This pressureless joining technique paves the way for broader applications of high-performance SiC components, particularly in industries demanding advanced material integrity and reliability.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"51 13\",\"pages\":\"Pages 17162-17171\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2025-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0272884225005474\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0272884225005474","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
Microstructural and mechanical properties of reaction-bonded silicon carbide (RBSiC) brazed with Si-Ti eutectic alloy
The self-joining of Reaction-Bonded Silicon Carbide (RBSiC) was achieved using a Si-Ti eutectic alloy via vacuum brazing, offering a novel approach for high-performance SiC component integration. This study provides a comprehensive investigation into the wetting behavior of the Si-Ti eutectic on RBSiC, coupled with a detailed analysis of how brazing temperature influences joint microstructure, mechanical properties, and fracture morphology. The Si-Ti eutectic alloy exhibits an exceptionally low contact angle of 15° on the RBSiC surface, indicating superior wettability and spreading characteristics critical for robust bonding. The joints were primarily formed through atomic-scale interactions, with no new intermetallic compounds generated, ensuring the long-term stability of the interface. Brazing at 1375 °C for 15 min resulted in a shear strength of 154 MPa, with fracture occurring at the substrate, highlighting the excellent mechanical properties of the joints. The evolution of the joint microstructure and the underlying strengthening mechanisms were elucidated, providing insights into the intrinsic behavior of the bonding process. This pressureless joining technique paves the way for broader applications of high-performance SiC components, particularly in industries demanding advanced material integrity and reliability.
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.