磁脉冲辅助Cu/Al半固态钎焊接头的组织演变与力学性能

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-05-02 DOI:10.1016/j.matlet.2025.138682

Zhenglei Rui, Shangyu Huang, Huajun Wang

{"title":"磁脉冲辅助Cu/Al半固态钎焊接头的组织演变与力学性能","authors":"Zhenglei Rui, Shangyu Huang, Huajun Wang","doi":"10.1016/j.matlet.2025.138682","DOIUrl":null,"url":null,"abstract":"<div><div>This study uses magnetic pulse-assisted semi-solid brazing (MPASSB) to join Cu/Al tubes. By modulating brazing forming voltage, solid–liquid interfacial interactions are controlled, and their effects on oxide removal, elemental diffusion, and microstructure are analyzed. Results demonstrate that the MPASSB method achieves metallurgically bonded joints without brittle Cu/Al intermetallic compounds (IMCs). Meanwhile, increasing the brazing forming voltage enhances interfacial interactions, promoting the removal of the copper-side (Cu-side) oxide film and accelerating elemental diffusion. Furthermore, by adjusting the brazing forming voltage, high-quality joints with shear strength of up to 70.6 MPa can be achieved.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"395 ","pages":"Article 138682"},"PeriodicalIF":2.7000,"publicationDate":"2025-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructure evolution and mechanical properties of Cu/Al magnetic pulse-assisted semi-solid brazed joints\",\"authors\":\"Zhenglei Rui, Shangyu Huang, Huajun Wang\",\"doi\":\"10.1016/j.matlet.2025.138682\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This study uses magnetic pulse-assisted semi-solid brazing (MPASSB) to join Cu/Al tubes. By modulating brazing forming voltage, solid–liquid interfacial interactions are controlled, and their effects on oxide removal, elemental diffusion, and microstructure are analyzed. Results demonstrate that the MPASSB method achieves metallurgically bonded joints without brittle Cu/Al intermetallic compounds (IMCs). Meanwhile, increasing the brazing forming voltage enhances interfacial interactions, promoting the removal of the copper-side (Cu-side) oxide film and accelerating elemental diffusion. Furthermore, by adjusting the brazing forming voltage, high-quality joints with shear strength of up to 70.6 MPa can be achieved.</div></div>\",\"PeriodicalId\":384,\"journal\":{\"name\":\"Materials Letters\",\"volume\":\"395 \",\"pages\":\"Article 138682\"},\"PeriodicalIF\":2.7000,\"publicationDate\":\"2025-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Letters\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0167577X25007116\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X25007116","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

摘要

本研究采用磁脉冲辅助半固态钎焊（MPASSB）连接Cu/Al管。通过调节钎焊成形电压，控制固液界面相互作用，并分析其对氧化去除、元素扩散和微观组织的影响。结果表明，MPASSB方法可以实现冶金结合，无脆性Cu/Al金属间化合物（IMCs）。同时，提高钎焊成形电压增强了界面相互作用，促进了铜侧（cu侧）氧化膜的去除，加速了元素扩散。通过调整钎焊成形电压，可获得抗剪强度达70.6 MPa的高质量接头。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Microstructure evolution and mechanical properties of Cu/Al magnetic pulse-assisted semi-solid brazed joints

This study uses magnetic pulse-assisted semi-solid brazing (MPASSB) to join Cu/Al tubes. By modulating brazing forming voltage, solid–liquid interfacial interactions are controlled, and their effects on oxide removal, elemental diffusion, and microstructure are analyzed. Results demonstrate that the MPASSB method achieves metallurgically bonded joints without brittle Cu/Al intermetallic compounds (IMCs). Meanwhile, increasing the brazing forming voltage enhances interfacial interactions, promoting the removal of the copper-side (Cu-side) oxide film and accelerating elemental diffusion. Furthermore, by adjusting the brazing forming voltage, high-quality joints with shear strength of up to 70.6 MPa can be achieved.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive