真空钎焊诱导AgCuTi/Cu体系溶解机理

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-05-03 DOI:10.1016/j.matlet.2025.138684

Jiapeng Wu , Kun Yu , Yifeng Wang , Zhijun Li , Wenzhu Zhang , Mingqiang Xie , Lin Kong

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引用次数: 0

摘要

本文研究了Ag-26.5Cu-1.5Ti （wt%）合金粉末对铜的随时间温度变化的溶解行为。在真空条件下长时间的热暴露会导致大量的铜溶解。显微组织分层显示出两个明显的区域：I区以Cu（s,s）、Ag-Cu共晶相为主，II区含Cu（s,s）、Ag-Cu共晶相、Ti2Cu和TiCu。分析表明，在880°C下，30分钟内达到接近平衡的溶解。提出了四阶段溶解机理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Vacuum brazing-induced dissolutive mechanisms in AgCuTi/Cu system

This study investigates the time–temperature-dependent dissolutive behavior of copper using Ag-26.5Cu-1.5Ti (wt%) alloy powder. Prolonged thermal exposure under vacuum conditions causes significant Cu dissolution. Microstructural stratification reveals two distinct zones: Zone I dominated by Cu(s,s), Ag-Cu eutectic phase and Zone II containing Cu(s,s), Ag-Cu eutectic phase, Ti₂Cu and TiCu. Analysis demonstrates near-equilibrium dissolution attainment within 30 min at 880 °C. A four-stage dissolutive mechanism is proposed.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive