Integrated embedded cooling method for thermal management in multilayer ceramic circuit substrate microsystems for multi-chip components

With the advancement of high-density integrated packaging for multi-chip components, effective thermal management has become increasingly critical. In this paper, we present an integrated microsystem package design aimed at addressing the thermal management challenges of high-power multi-chip components through the use of interlayer microchannel manifolds. By combining multi-chip components with embedded cooling technology, we significantly reduce thermal resistance, resulting in compact, lightweight, and highly efficient microsystems. Initially, we employed high-temperature co-firing ceramic technology to integrate multilayer circuits with the flow channel manifold structure. Silicon-based thermal test chips featuring various microchannel designs were fabricated in the near-junction area. The ceramic substrate was subsequently bonded with the thermal test chip to create a cohesive multi-chip assembly. The multi-chip component is 3 mm thick with integrated circuitry and microfluidic packaging for uniform coolant distribution. To evaluate heat transfer performance, we constructed a measurement platform and established a simulation model for the multi-chip components. We analyzed the effects of non-uniform heat source distribution and different configurations in the embedded microchannel area region. Our results indicate that the simulation predicts a maximum temperature difference of 2 K within the designed manifold flow channel. Experimental findings demonstrate that when the total power of the multichip components is 128 W (heat flux 356 W/cm²) and the flow rate is 142.8 mL/min, the average temperature of the multichip components is reduced by 11 °C, a decrease in thermal resistance by 34.5 %, and an enhancement in temperature uniformity by 53.1 %. This research provides robust theoretical insights for the future development of thermal management strategies in high-power multi-chip components.