用于人工智能芯片的铁电器件

Chip Pub Date : 2025-01-25 DOI:10.1016/j.chip.2025.100129
Jinshun Bi , Muhammad Faizan , Xuefei Liu , Yue Ma , Xu Wang , Viktor Stempitsky
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引用次数: 0

摘要

在氧化物(如氧化铪)中发现铁电性,这与当代半导体制造技术兼容,有助于在尖端微电子中铁电器件的复兴。在晶体管结构中,铁电器件起着将铁电材料连接到半导体的作用,半导体在单个器件的水平上结合了存储和逻辑操作,从而满足了人工智能(A.I)芯片新范式的一些最基本的硬件要求。在这篇综述中,我们解决了与材料和器件级先进技术节点(≤10nm)的大批量制造相关的问题。此外,我们还回顾了人工智能芯片的进展,如神经启发计算机芯片。对于基于非易失性存储器的神经启发的人工智能芯片,建议进行基准测试的四个重要指标:计算密度、能源效率、学习能力和计算精度。据推测,铁电器件可以成为未来人工智能芯片设计中的主要硬件元素,这将导致一种被称为铁电子学的创新电子方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ferroelectric devices for artificial intelligence chips
The identification of ferroelectricity in oxides such as hafnium oxide, which are compatible with the contemporary semiconductor fabrication techniques, has contributed to a resurgence of ferroelectric devices in cutting-edge microelectronics. In a transistor structure, ferroelectric devices play the role of connecting a ferroelectric material to a semiconductor, which combines memory and logic operations at the level of a single device, thus meeting some of the most essential hardware requirements for new paradigms for artificial intelligence (A.I) chips. In this review, we addressed the issues associated with high-volume fabrication at advanced technology nodes (10nm) at the material and device level. Moreover, we also reviewed the advancement of A.I chips such as neuro-inspired computer chips. For neuro-inspired A.I chips based on nonvolatile memory, four important metrics are suggested for benchmarking: computing density, energy efficiency, learning capability, and computing accuracy. It is inferred that ferroelectric devices can be a major hardware element in the design of future A.I chips, which will leads to an innovative approach to electronics that is termed ferroelectronics.
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CiteScore
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