首次揭示金属薄膜电容器的自愈:宏观-微观分析

IF 4.4 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
High Voltage Pub Date : 2025-02-24 DOI:10.1049/hve2.70005
Yushuang He, Feipeng Wang, Guoqiang Du, Lei Pan, Jian Li, Hongming Yang, Xiao Zhang, Zhicheng Zhang, Kaizheng Wang
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引用次数: 0

摘要

金属化薄膜电容器(mfc)以其独特的自愈(SH)特性而闻名,这使它们在面对强电场、高压和脉冲功率应用时具有卓越的可靠性和稳定性。然而,对于单层介质膜的SH特性的探索对于推进MFC可靠性评估仍存在不足。为了建立从装置到mfc中膜的SH特性的理论相关性,本工作开发了一个模拟模型来分析mfc中的SH动态行为。重点研究了耦合电容、电弧电阻和绝缘电阻对mfc烧结过程中宏观特性(压降和脉冲电流)的影响。结果表明,SH主要与压降持续时间有关,而与采样电流无关。因此,MFC中的SH过程的特征是电压突然降低到最小值。这种改进增强了MFC的SH能量耗散模型。建立了不同SH能级下mfc宏观特性与微观结构演变(聚丙烯分解和铝电极汽化)之间的量化关系。随着SH能量和持续时间的增加,归因于聚丙烯分解的能量比例增加,导致多层烧蚀和金属化膜内的粘附,MFC电气性能明显恶化。宏观微观视角的研究揭示了mfc中控制SH行为的复杂机制,为其设计的进步、可靠性评估和各种电气应用中的性能优化提供了有价值的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Unveiling first self-healing in metallised film capacitor: A macro–micro analysis

Unveiling first self-healing in metallised film capacitor: A macro–micro analysis

Metallised film capacitors (MFCs) are renowned for their unique self-healing (SH) properties, which bestow them with exceptional reliability and stability in the face of intense electric fields, high voltages, and pulse power applications. Nonetheless, the exploration of SH characteristics concerning single-layer dielectric film remains insufficient for advancing MFC reliability evaluation. To establish the theoretical correlation of SH characteristics from the device to the film in the MFCs, this work developed a simulation model to analyse the SH dynamic behaviour in the MFCs. The effects of coupling capacitors, arc resistance and insulation resistance on the macroscopic characteristics (voltage drop and pulse current) are focused during the SH process in MFCs. The results indicate that SH is primarily associated with the voltage drop duration rather than the sampling current. Consequently, the SH process in MFC is characterised as an abrupt decrease in voltage to its minimum value. This refinement enhances the SH energy dissipation model of MFC. The quantified relationship between the macroscopic characteristics and microstructure evolution (polypropylene decomposition and aluminium electrode vaporisation) is established in MFCs under diverse SH energy levels. As SH energy and duration increase, the proportion of energy attributed to polypropylene decomposition increases, resulting in multi-layer ablation and adhesion within the metallised film and a pronounced deterioration in MFC electrical performance. The examination of macro–micro perspectives sheds new light on the intricate mechanisms governing the SH behaviour in MFCs, offering valuable insights for the advancement of their design, reliability evaluation, and performance optimisation in diverse electrical applications.

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来源期刊
High Voltage
High Voltage Energy-Energy Engineering and Power Technology
CiteScore
9.60
自引率
27.30%
发文量
97
审稿时长
21 weeks
期刊介绍: High Voltage aims to attract original research papers and review articles. The scope covers high-voltage power engineering and high voltage applications, including experimental, computational (including simulation and modelling) and theoretical studies, which include: Electrical Insulation ● Outdoor, indoor, solid, liquid and gas insulation ● Transient voltages and overvoltage protection ● Nano-dielectrics and new insulation materials ● Condition monitoring and maintenance Discharge and plasmas, pulsed power ● Electrical discharge, plasma generation and applications ● Interactions of plasma with surfaces ● Pulsed power science and technology High-field effects ● Computation, measurements of Intensive Electromagnetic Field ● Electromagnetic compatibility ● Biomedical effects ● Environmental effects and protection High Voltage Engineering ● Design problems, testing and measuring techniques ● Equipment development and asset management ● Smart Grid, live line working ● AC/DC power electronics ● UHV power transmission Special Issues. Call for papers: Interface Charging Phenomena for Dielectric Materials - https://digital-library.theiet.org/files/HVE_CFP_ICP.pdf Emerging Materials For High Voltage Applications - https://digital-library.theiet.org/files/HVE_CFP_EMHVA.pdf
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