{"title":"层状PbBi4Te7化合物的热电性能","authors":"Hong Zeng, Liqing Xu, Wei Liu, Xinxiu Cheng, Wenke He, Yu Xiao","doi":"10.1007/s40195-024-01811-z","DOIUrl":null,"url":null,"abstract":"<div><p>The layered PbBi<sub>4</sub>Te<sub>7</sub> compound is considered a promising thermoelectric material due to its unusually high electrical transport properties in ternary compound systems. However, its high carrier concentration leads to relatively high thermal conductivity and low Seebeck coefficient, limiting the enhancement of its thermoelectric performance. In this work, we introduce Se alloying and Cu doping to synergistically regulate the thermoelectric transport properties of PbBi<sub>4</sub>Te<sub>7</sub>. Se alloying induces strong lattice contraction and increased interlayer electron scattering, significantly reducing lattice thermal conductivity while enhancing the Seebeck coefficient. Besides, Cu doping forms interlayer electron transport channels thus optimizing carrier mobility and electrical transport properties. Cu substitution also enhances point defect scattering further suppressing phonon transport. Ultimately, the strong anharmonic structure formed by Se alloying and Cu-induced phonon scattering results in a remarkably low lattice thermal conductivity of 0.27 W m<sup>−1</sup> K<sup>−1</sup> at 300 K in PbBi<sub>4</sub>Te<sub>5</sub>Se<sub>2</sub>-0.1% Cu samples. The maximum thermoelectric figure of merit (<i>ZT</i><sub>max</sub>) is increased to 0.68, with an average thermoelectric figure of merit (<i>ZT</i><sub>ave</sub>) of 0.56 in the near-room temperature range (300–573 K), outperforming other typical ternary Pb-Bi-based compounds.</p></div>","PeriodicalId":457,"journal":{"name":"Acta Metallurgica Sinica-English Letters","volume":"38 5","pages":"772 - 780"},"PeriodicalIF":2.9000,"publicationDate":"2025-01-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermoelectric Performance of Layered PbBi4Te7 Compound\",\"authors\":\"Hong Zeng, Liqing Xu, Wei Liu, Xinxiu Cheng, Wenke He, Yu Xiao\",\"doi\":\"10.1007/s40195-024-01811-z\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The layered PbBi<sub>4</sub>Te<sub>7</sub> compound is considered a promising thermoelectric material due to its unusually high electrical transport properties in ternary compound systems. However, its high carrier concentration leads to relatively high thermal conductivity and low Seebeck coefficient, limiting the enhancement of its thermoelectric performance. In this work, we introduce Se alloying and Cu doping to synergistically regulate the thermoelectric transport properties of PbBi<sub>4</sub>Te<sub>7</sub>. Se alloying induces strong lattice contraction and increased interlayer electron scattering, significantly reducing lattice thermal conductivity while enhancing the Seebeck coefficient. Besides, Cu doping forms interlayer electron transport channels thus optimizing carrier mobility and electrical transport properties. Cu substitution also enhances point defect scattering further suppressing phonon transport. Ultimately, the strong anharmonic structure formed by Se alloying and Cu-induced phonon scattering results in a remarkably low lattice thermal conductivity of 0.27 W m<sup>−1</sup> K<sup>−1</sup> at 300 K in PbBi<sub>4</sub>Te<sub>5</sub>Se<sub>2</sub>-0.1% Cu samples. The maximum thermoelectric figure of merit (<i>ZT</i><sub>max</sub>) is increased to 0.68, with an average thermoelectric figure of merit (<i>ZT</i><sub>ave</sub>) of 0.56 in the near-room temperature range (300–573 K), outperforming other typical ternary Pb-Bi-based compounds.</p></div>\",\"PeriodicalId\":457,\"journal\":{\"name\":\"Acta Metallurgica Sinica-English Letters\",\"volume\":\"38 5\",\"pages\":\"772 - 780\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2025-01-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Acta Metallurgica Sinica-English Letters\",\"FirstCategoryId\":\"1\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s40195-024-01811-z\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"METALLURGY & METALLURGICAL ENGINEERING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Metallurgica Sinica-English Letters","FirstCategoryId":"1","ListUrlMain":"https://link.springer.com/article/10.1007/s40195-024-01811-z","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"METALLURGY & METALLURGICAL ENGINEERING","Score":null,"Total":0}
引用次数: 0
摘要
层状PbBi4Te7化合物由于其在三元化合物体系中异常高的电输运特性而被认为是一种很有前途的热电材料。但由于载流子浓度高,导致其导热系数相对较高,塞贝克系数较低,限制了其热电性能的提高。在这项工作中,我们引入Se合金化和Cu掺杂来协同调节PbBi4Te7的热电输运性质。Se合金化导致晶格收缩强烈,层间电子散射增加,显著降低晶格导热系数,提高塞贝克系数。此外,Cu掺杂形成层间电子输运通道,从而优化载流子迁移率和电输运性能。铜取代还增强了点缺陷散射,进一步抑制了声子输运。最终,由Se合金化和Cu诱导声子散射形成的强非谐波结构导致PbBi4Te5Se2-0.1% Cu样品在300 K时的晶格热导率非常低,为0.27 W m−1 K−1。在近室温(300-573 K)范围内,最大热电优值(ZTmax)提高到0.68,平均热电优值(ZTave)为0.56,优于其他典型的三元铅铋基化合物。
Thermoelectric Performance of Layered PbBi4Te7 Compound
The layered PbBi4Te7 compound is considered a promising thermoelectric material due to its unusually high electrical transport properties in ternary compound systems. However, its high carrier concentration leads to relatively high thermal conductivity and low Seebeck coefficient, limiting the enhancement of its thermoelectric performance. In this work, we introduce Se alloying and Cu doping to synergistically regulate the thermoelectric transport properties of PbBi4Te7. Se alloying induces strong lattice contraction and increased interlayer electron scattering, significantly reducing lattice thermal conductivity while enhancing the Seebeck coefficient. Besides, Cu doping forms interlayer electron transport channels thus optimizing carrier mobility and electrical transport properties. Cu substitution also enhances point defect scattering further suppressing phonon transport. Ultimately, the strong anharmonic structure formed by Se alloying and Cu-induced phonon scattering results in a remarkably low lattice thermal conductivity of 0.27 W m−1 K−1 at 300 K in PbBi4Te5Se2-0.1% Cu samples. The maximum thermoelectric figure of merit (ZTmax) is increased to 0.68, with an average thermoelectric figure of merit (ZTave) of 0.56 in the near-room temperature range (300–573 K), outperforming other typical ternary Pb-Bi-based compounds.
期刊介绍:
This international journal presents compact reports of significant, original and timely research reflecting progress in metallurgy, materials science and engineering, including materials physics, physical metallurgy, and process metallurgy.