CoSb3/Ni界面结构及力学性能第一性原理研究

IF 2.9 2区 材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING
Cuicui Shu, Pengcheng Zhai, Xiege Huang, Sergey I. Morozov, Guodong Li, Zhiyuan Pan
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引用次数: 0

摘要

机械稳定性在热电器件的设计中是至关重要的。在本研究中,我们采用基于密度泛函理论的第一性原理计算来研究CoSb3/Ni界面的破坏机制。结果表明,CoSb3(100)/Ni(100)和CoSb3(100)/Ni(111)_1是较好的界面结构。CoSb3/Ni界面的理想抗拉强度明显低于本体CoSb3,这可能是由于界面附近的结构重排削弱了Co-Sb键的强度。界面破坏发生在CoSb3中,其中共价Sb-Sb键由于相对较低的刚性,比离子Co-Sb键更容易软化。因此,Co-Sb键的断裂导致界面破坏。单层Sb_CoSb3(100)/Ni(100)和单层Sb_CoSb3(100)/Ni(111)_1界面的结构破坏是由于CoSb3中间Co-Sb键的断裂,而双层Sb_CoSb3(100)/Ni(100)和双层Sb_CoSb3(100)/Ni(111)_1界面的结构破坏是由于最上层Co-Sb键的断裂。这种行为主要是由于Sb_CoSb3界面附近的原子重排促进了Sb-Ni和Co-Ni之间的键形成,从而增强了CoSb3上层结构内的稳定性。本研究将为热电器件的界面设计提供理论依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
First Principles Study of CoSb3/Ni Interface Structure and Mechanical Properties

Mechanical stability is critically essential in the design of thermoelectric devices. In this study, we employed first-principles calculations based on density functional theory to investigate the failure mechanisms at the CoSb3/Ni interface. Our findings reveal that the CoSb3(100)/Ni(100) and CoSb3(100)/Ni(111)_1 configurations are favorable interface structures. The ideal tensile strength of the CoSb3/Ni interface is markedly lower than that of bulk CoSb3, which can be attributed to structural rearrangements near the interface that weaken the strength of the Co–Sb bonds. Interface failure occurs in CoSb3, where covalent Sb–Sb bonds exhibit a tendency to soften prior to the ionic Co–Sb bonds due to their comparatively lower rigidity. Consequently, the breakage of the Co–Sb bonds leads to interface failure. Structural failure at both single-layer Sb_CoSb3(100)/Ni(100) and single-layer Sb_CoSb3(100)/Ni(111)_1 interfaces results from ruptures in intermediate Co–Sb bonds in CoSb3, whereas failures at double-layer Sb_CoSb3(100)/Ni(100) and double-layer Sb_CoSb3(100)/Ni(111)_1 interfaces stem from fractures in the uppermost Co–Sb bonds. This behavior is primarily driven by atomic rearrangements near the single-layer Sb_CoSb3 interface, which promote bond formation between Sb–Ni and Co–Ni, thereby enhancing stability within the superstructure of CoSb3. This study will provide a theoretical basis for the interface design of thermoelectric devices.

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来源期刊
Acta Metallurgica Sinica-English Letters
Acta Metallurgica Sinica-English Letters METALLURGY & METALLURGICAL ENGINEERING-
CiteScore
6.60
自引率
14.30%
发文量
122
审稿时长
2 months
期刊介绍: This international journal presents compact reports of significant, original and timely research reflecting progress in metallurgy, materials science and engineering, including materials physics, physical metallurgy, and process metallurgy.
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