四面体中锡掺杂的三重协同调制:高热电性能的电子结构、DOS和散射工程

IF 8.2 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Lulu Huang, Shanhong Wan, Junyang Wu, Binbin Wang, Hongsong Yu, Yu Liu, Jinhua Zhang, Yucheng Wu, Xuemei Zhang, Jian Yan, Jian Zhang
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引用次数: 0

摘要

实现高功率因数和低晶格导热系数是提高热电性能的关键。生态友好型Cu12Sb4S13四面体本身具有高功率因数(~ 10-14 μW cm-1 K-2)和低导热系数(0.5-1.00 W m-1 K-1),但这些特性也对进一步提高性能造成了重大限制。为了克服这些挑战,研究人员探索了共掺杂/协同元素掺杂和纳米复合材料等策略。在这项工作中,我们证明了在Cu12Sb4S13的Sb位点掺杂Sn(不使用纳米复合材料)能够协同调制电子和热性能。Sn掺杂增加了空穴浓度,增强了态密度(DOS),导致功率因数(750 K时)显著提高,从x = 0时的12 μW cm-1 K - 2到x = 0.04时的16 μW cm-1 K - 2。同时,锡掺杂引起强声子散射,使热导率降低约69%(在750 K时)。这种电子结构、DOS和散射机制的协同调制导致热电性能的显著增强。优化后的Cu12Sb3.96Sn0.04S13样品在750 K时表现出1.26的优异性能(ZT),与原始Cu12Sb4S13相比提高了126%。这些发现证明了Sn掺杂通过协同调制Cu12Sb4S13的电子结构、态密度和声子散射机制,同时优化Cu12Sb4S13的电学和热性能的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Triple Synergistic Modulation via Sn Doping in Tetrahedrites: Electronic Structure, DOS, and Scattering Engineering for a High Thermoelectric Performance

Triple Synergistic Modulation via Sn Doping in Tetrahedrites: Electronic Structure, DOS, and Scattering Engineering for a High Thermoelectric Performance
Achieving a high power factor and low lattice thermal conductivity is crucial for improving the thermoelectric performance. The eco-friendly Cu12Sb4S13 tetrahedrite inherently exhibits a high power factor (∼10–14 μW cm–1 K–2) and low thermal conductivity (0.5–1.00 W m–1 K–1), but these properties also impose significant limitations for further performance enhancement. To overcome these challenges, researchers have explored strategies such as codoping/synergistic element doping and nanocomposites. In this work, we demonstrate that Sn doping at the Sb site in Cu12Sb4S13 (without the use of nanocomposites) enables the synergistic modulation of both the electronic and thermal properties. The Sn doping increases the hole concentration and enhances the density of states (DOS), leading to a marked improvement in the power factor (at 750 K), 12 μW cm–1 K–2 for x = 0 to 16 μW cm–1 K–2 for x = 0.04. Simultaneously, Sn doping induces strong phonon scattering, which lowers thermal conductivity by ∼69% (at 750 K). This synergistic modulation of the electronic structure, DOS, and scattering mechanisms results in a significant enhancement in the thermoelectric performance. The optimized Cu12Sb3.96Sn0.04S13 sample exhibits an exceptional figure of merit (ZT) of 1.26 at 750 K, representing a 126% increase compared to pristine Cu12Sb4S13. These findings demonstrate the effectiveness of Sn doping in simultaneously optimizing the electrical and thermal properties of Cu12Sb4S13 through the synergistic modulation of the electronic structure, density of states, and phonon scattering mechanisms.
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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