掺杂诱导的(1−x) NaNbO3-xBiGdKZrO3微电子陶瓷的结构、光学和电学修饰

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
P. Elaiyaraja, N. Karunagaran, M. Muralidharan, S. Gokul Raj
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引用次数: 0

摘要

采用两步烧结工艺制备了无铅(1-x)NaNbO3-xBiGdKZrO3 (x = 0.00, 0.02, 0.04, 0.06)陶瓷,并对其电学、光学和结构性能进行了研究。XRD结果表明,复合材料均呈现钙钛矿结构,并在x = 0.04时由正交晶型(Pbma)转变为拟立方晶型(pm - 3m)。晶格参数从a = 3.938°C, b = 3.927°C, C = 3.915°C (x = 0.00)变为a = 3.952°C, b = 3.952°C, C = 3.949°C (x = 0.06),这意味着对称性增强,缺陷松弛。拉曼光谱显示,从277厘米到251厘米的毒发展,从24.96厘米(x = 0.00)到27.66厘米(x = 0.06)的毒发展高峰,证实了由缺陷驱动的结构变化和向立方对称的转变。XPS分析通过鉴定氧化态和化学键证实了BiGdKZrO₃的成功结合。紫外可见光谱显示出3.34 ~ 3.41 eV的带隙,这是由电荷修正和缺陷引起的带尾造成的。FE-SEM和HRTEM研究表明,在x = 0.04时晶粒均匀分布,晶格明显变形。SAED模式转变为分散的环,证实了相变和缺陷的发展。电阻抗谱显示,随着频率和温度(410-500℃,1 Hz-1 MHz)的增加,交流电导率增强。在1 MHz时,复介电常数(ε′)从215 (x = 0.00)增加到287 (x = 0.06),而在500°C时,交流电导率从1.2 × 10 - 5秒/厘米(x = 0.00)增加到3.8 × 10 - 5秒/厘米(x = 0.06),证实了电荷传输的增强。实介电常数和虚介电常数表现出频率相关的弛豫行为,而电模量分析显示出体和晶界的贡献。在较高的掺杂浓度下,材料表现为负介电常数,这可能是由于挠曲电效应和偶极极化所致。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Doping-induced structural, optical, and electrical modifications in (1−x)NaNbO3–xBiGdKZrO3 ceramics for microelectronic applications

A two-step sintering process was used to create ceramics composed of lead-free (1-x)NaNbO3-xBiGdKZrO3 (x = 0.00, 0.02, 0.04, 0.06), and their electrical, optical, and structural properties were investigated. The XRD results revealed that all of the combinations exhibited a perovskite structure, with a phase transition from orthorhombic (Pbma) to pseudo-cubic (Pm-3 m) at x = 0.04. The lattice parameters changed from a = 3.938 °C, b = 3.927 °C, and c = 3.915 °C (x = 0.00) to a = 3.952 °C, b = 3.952 °C, and c = 3.949 °C (x = 0.06), which means there is more symmetry and defects are relaxing. Raman spectroscopy revealed a peak shift from 277 to 251 cm⁻1 and an FWHM increase from 24.96 cm⁻1 (x = 0.00) to 27.66 cm⁻1 (x = 0.06), confirming defect-driven structural modifications and a transition to cubic symmetry. XPS analysis confirmed the successful incorporation of BiGdKZrO₃ by identifying oxidation states and chemical bonding. The UV–Vis spectra showed a band gap between 3.34 and 3.41 eV, which is caused by charge correction and band tailing caused by defects. FE-SEM and HRTEM studies showed that the grains are spread out evenly and that the lattice was significantly distorted at x = 0.04. The SAED patterns changed to dispersed rings, which confirmed the phase transition and the development of defects. Electrical impedance spectroscopy showed enhanced AC conductivity with increasing frequency and temperature (410–500 °C, 1 Hz–1 MHz). Complex permittivity (εʹ) increased from 215 (x = 0.00) to 287 (x = 0.06) at 1 MHz, while AC conductivity at 500 °C rose from 1.2 × 10⁻5 S/cm (x = 0.00) to 3.8 × 10⁻5 S/cm (x = 0.06), confirming enhanced charge transport. The real and imaginary permittivity exhibited frequency-dependent relaxation behavior, while electrical modulus analysis indicated bulk and grain boundary contributions. At higher dopant concentrations, the materials showed negative permittivity, which may be attributed to flexoelectric effects and dipolar polarization.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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