棉/MXene/PPy/CuI复合热电织物的研制与表征

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shaohui Zhu, Yueqin Fang, Xiaohan Du, Yilong Han, Shuai Wang, Qiang Xu, Junshuo Zhang, Xiao Zhang, Shuliang Lv, Haihui Liu
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引用次数: 0

摘要

热电织物可以利用人体与环境之间的温差为可穿戴设备产生能量。然而,非稀缺材料的性能目前还不足以大规模应用。在本研究中,通过浸涂工艺将高导电性的MXene (Ti3C2Tx)与棉织物结合,然后进行原位聚合,在棉织物表面涂覆聚吡咯(PPy)和CuI纳米晶体。MXene的引入增强了织物的导电性,而PPy与MXene之间的静电相互作用和π-π共轭作用修饰了MXene层的缺陷,填补了层间的空隙,增加了电荷传导路径的数量,从而提高了导电性。纳米晶的沉积进一步提高了塞贝克系数。棉/MXene/PPy/CuI复合热电织物的电导率为12.6 S cm−1,塞贝克系数为49.2 μV K−1,功率因数为3050 nW m−1 K−2,同时具有良好的柔韧性和稳定性。使用22对TE织物的热电发电机(f-TEG)在ΔT为30 K时产生44 mV,升压到3.67 V,足以为小型电子设备供电。这项研究为便携式热电发电机和可穿戴设备的能源供应解决方案提供了新的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development and characterization of cotton/MXene/PPy/CuI composite thermoelectric fabric

Thermoelectric fabrics can generate energy for wearable devices by utilizing the temperature difference between the human body and the environment. However, the performance of non-scarce materials is currently insufficient for large-scale applications. In this study, a high-conductivity MXene (Ti3C2Tx) was combined with cotton fabric via a dip-coating process, followed by in-situ polymerization to coat the surface with polypyrrole (PPy) and CuI nanocrystals. The introduction of MXene enhanced the fabric’s conductivity, while the electrostatic interaction and π-π conjugation between PPy and MXene modified the MXene layer defects and filled the gaps between layers, increasing the number of charge conduction paths and thus improving conductivity. The deposition of CuI nanocrystals further boosted the Seebeck coefficient. The resulting Cotton/MXene/PPy/CuI composite thermoelectric fabric achieved a conductivity of 12.6 S cm−1, a Seebeck coefficient of 49.2 μV K−1, and a power factor of 3050 nW m−1 K−2, while also exhibiting excellent flexibility and stability. A thermoelectric generator (f-TEG) with 22 pairs of TE fabrics generated 44 mV at a ΔT of 30 K, which was boosted to 3.67 V, sufficient to power small electronic devices. This study provides new insights into energy supply solutions for portable thermoelectric generators and wearable devices.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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