Controlling adhesion of PDMS elastomer through process parameters

As technology advances and devices miniaturize, controlling adhesion becomes critical. Adhesion is also a significant cause of failure in MEMS and NEMS devices. Examples of PDMS elastomers-based micro and nanodevices include biochips, triboelectric nanogenerators, electronic sensors, and microfluidic devices. Surface adhesion of PDMS elastomer can be managed through various techniques, including chemical surface treatments, altering surface textures, surface grafting, applying external adhesive layers, introducing material heterogeneity, and modifying the material’s mechanical properties. This research aims to tune adhesion by altering the mechanical properties, such as the modulus of elasticity of PDMS elastomer, through changes in process parameters, specifically curing temperature and curing time. We used the wedge test to determine the adhesion between the PDMS elastomer and the borosilicate glass slide. This approach creates the wedge by inserting a glass coverslip at the interface. We see a significant increase in the modulus of elasticity, an increase in equilibrium crack length, and a drop in the work of adhesion when the PDMS elastomer’s curing temperature and curing time rise. We exhibit and discuss how the process parameters affect the modulus of elasticity of the PDMS elastomer and its adhesion behavior to a borosilicate glass slide.