高精度SAR adc中电容失配的指数增量量化校准

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2025-04-18 DOI:10.1016/j.mejo.2025.106696

Zheyu Zhang, Yuzhou Xiong, Yanbo Zhang, Shubin Liu, Zhangming Zhu

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引用次数: 0

摘要

提出了一种高精度SAR adc的前景标定方法。所提出的校准方法基于指数增量adc原理，在不修改CDAC和显著增加电路复杂度的前提下，拓宽了自校准方法的误差检测范围，有效提高了校准效果。在MATLAB中的18位SAR ADC行为模型中验证了所提出的校准方法的有效性，结果表明，18位SAR ADC的SNDR/SFDR分别提高了30.41 dB和43.09 dB。

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Exponential-incremental quantization-based calibration for capacitor mismatch in high-precision SAR ADCs

This brief proposes a foreground calibration method for high-precision SAR ADCs. The proposed calibration method is based on the principle of exponential incremental ADCs, which broadens the error detection range of the self-calibration method and effectively improves the calibration effect without modifying the CDAC or significantly increasing circuit complexity. The effectiveness of the proposed calibration method is validated in an 18-bit SAR ADC behavioral model in MATLAB, demonstrating SNDR/SFDR improvements of 30.41 dB and 43.09 dB, respectively, for an 18-bit SAR ADC.

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.