用于气体传感器的SnO2纳米棒- si微柱树形结构的制备

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jing Liu, Futing Yi, Tianchong Zhang, Bo Wang
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引用次数: 0

摘要

利用水热法首次成功地在硅微柱表面制备了SnO2纳米棒,形成了树状结构。并将该结构应用于气体传感器中。在制备过程中,在硅片上制备了许多微柱,以克服SnO2纳米棒脱落的问题。通过水热反应在无数硅微柱表面制备了SnO2纳米棒。硅微柱作为衬底可以提高SnO2纳米棒与Si表面的粘附性,这是在Si表面成功生长SnO2纳米棒的关键一步。本研究优化了合成SnO2纳米棒的主要条件,包括原料浓度、反应时间、反应温度、Si微柱衬底形貌等,并对SnO2纳米棒的生长原理进行了研究。能量色散谱图和x射线衍射曲线表明,Si微柱上的SnO2纳米棒具有高纯度和良好的结晶度。将该SnO2纳米棒-Si微柱树状结构硅片用于气体传感器,气敏测试结果表明,该硅片对乙醇和丙酮都具有稳定的气敏性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of the SnO2 nanorods-Si micropillars tree-like structure for gas sensor application

It is the first time that the SnO2 nanorods are fabricated on Si micropillars surface to form tree-like structures by the hydrothermal method successfully. And this structure is used to the gas sensor application. During the fabrication process, numerous micropillars are prepared on the Si wafer to overcome the SnO2 nanorods falling off. The SnO2 nanorods are prepared on the countless Si micropillars surface via a hydrothermal reaction. The Si micropillars, serving as substrates, can improve the adhesion between the SnO2 nanorods and Si surface, which is a crucial step in successfully growing SnO2 nanorods on the Si surface. In this study, the main conditions for synthesizing SnO2 nanorods are optimized, including the concentration of the raw material, reaction time, reaction temperature, and the morphology of the Si micropillar substrate, and the growth principle of the SnO2 nanorods are researched. Energy dispersive spectroscopy patterns and X-ray diffraction curves indicate that the SnO2 nanorods on the Si micropillars exhibit high purity and good crystallinity. The Si wafer with this SnO2 nanorods-Si micropillar tree-like structures is used for gas sensor application, and the results of the gas sensitivity test show a stable gas sensitivity performance for both alcohol and acetone.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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