不同显微组织铜箔的力学性能及断裂行为

IF 4.8 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2025-04-19 DOI:10.1016/j.matchar.2025.115051

Bo-Yan Chen, Dinh-Phuc Tran, Kang-Ping Lee, Yun-Hsuan Chen, Chih Chen

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引用次数: 0

摘要

Cu在中等温度下的机械性能对半导体和电池的应用至关重要。在这项研究中，我们研究了六种不同微观结构的铜箔：粗晶（CG）、细晶（FG）、超细晶（UFG）、（110）孪晶（(110)T）、（111）纳米孪晶（(111)NT）和纳米孪晶+超细晶（NT + UFG）。25 ~ 200℃的拉伸试验表明，NT + UFG-Cu在25 ~ 75℃的拉伸强度最高，而（111）NT- cu在125 ~ 200℃的拉伸强度最强。在200°C时，由于动态恢复，CG-Cu的UTS下降了27.2%。FG-Cu和（110）T-Cu在动态再结晶和晶粒长大过程中分别损失了70%和66.6%。（111）由于动态再结晶、晶粒长大和脱孪，NT-Cu下降43.9%。由于晶界滑动，UFG-Cu和NT + UFG-Cu分别损失70.8%和75.2%。这些发现突出了不同Cu微观结构的不同断裂行为和中温弱化机制。

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Temperature-dependent mechanical properties and fracture behaviors of copper foils with different microstructures

The mechanical properties of Cu at intermediate temperatures are crucial for semiconductor and battery applications. In this study, we examine six types of Cu foils with different microstructures: coarse-grained (CG), fine-grained (FG), ultrafine-grained (UFG), (110) twinned ((110) T), (111) nanotwinned ((111) NT), and nanotwinned plus ultrafine-grained (NT + UFG). Tensile tests from 25 °C to 200 °C revealed that NT + UFG-Cu had the highest tensile strength from 25 °C to 75 °C, while (111) NT-Cu was strongest from 125 °C to 200 °C. CG-Cu showed a 27.2 % UTS drop at 200 °C due to dynamic recovery. FG-Cu and (110) T-Cu lost 70 % and 66.6 % from dynamic recrystallization and grain growth. (111) NT-Cu dropped 43.9 % due to dynamic recrystallization, grain growth, and detwinning. UFG-Cu and NT + UFG-Cu lost 70.8 % and 75.2 % due to grain boundary sliding. These findings highlight the distinct fracture behaviors and intermediate-temperature weakening mechanisms of different Cu microstructures.

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.