{"title":"SAC305/Cu焊点通过超快速冷却，具有较高的耐腐蚀性和抗拉强度","authors":"Jiyou Yang, Hao Ren, Linmei Yang, Te Huang, Bayaer Buren, Yawei Liang","doi":"10.1007/s10854-025-14787-y","DOIUrl":null,"url":null,"abstract":"<div><p>SAC305 alloy as a type of lead-free electronic material is expected to have high corrosion resistance and strength. In this study SAC305/Cu solder joints were prepared under three different cooling conditions. The corrosion behavior of the solder joint in 3.5wt% NaCl solution were investigated. The tensile strengths of solder joints before and after corrosion were tested. The results show that the Cu/SAC305/Cu solder joint prepared via rapid cooling always exhibited the most refined microstructure, the strongest corrosion resistance and the highest strength. The intermediate corrosion products were detected using energy dispersive spectrometer (EDS). After being corroded for 28 days, the strength of SAC305-W solder joint only decreased by 22.8%, while that of SAC305-F solder joint decreased by 56.2%. The difference in corrosion resistance is attributed to the influence of Ag<sub>3</sub>Sn on the corrosion current.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 12","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling\",\"authors\":\"Jiyou Yang, Hao Ren, Linmei Yang, Te Huang, Bayaer Buren, Yawei Liang\",\"doi\":\"10.1007/s10854-025-14787-y\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>SAC305 alloy as a type of lead-free electronic material is expected to have high corrosion resistance and strength. In this study SAC305/Cu solder joints were prepared under three different cooling conditions. The corrosion behavior of the solder joint in 3.5wt% NaCl solution were investigated. The tensile strengths of solder joints before and after corrosion were tested. The results show that the Cu/SAC305/Cu solder joint prepared via rapid cooling always exhibited the most refined microstructure, the strongest corrosion resistance and the highest strength. The intermediate corrosion products were detected using energy dispersive spectrometer (EDS). After being corroded for 28 days, the strength of SAC305-W solder joint only decreased by 22.8%, while that of SAC305-F solder joint decreased by 56.2%. The difference in corrosion resistance is attributed to the influence of Ag<sub>3</sub>Sn on the corrosion current.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 12\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-04-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14787-y\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14787-y","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling
SAC305 alloy as a type of lead-free electronic material is expected to have high corrosion resistance and strength. In this study SAC305/Cu solder joints were prepared under three different cooling conditions. The corrosion behavior of the solder joint in 3.5wt% NaCl solution were investigated. The tensile strengths of solder joints before and after corrosion were tested. The results show that the Cu/SAC305/Cu solder joint prepared via rapid cooling always exhibited the most refined microstructure, the strongest corrosion resistance and the highest strength. The intermediate corrosion products were detected using energy dispersive spectrometer (EDS). After being corroded for 28 days, the strength of SAC305-W solder joint only decreased by 22.8%, while that of SAC305-F solder joint decreased by 56.2%. The difference in corrosion resistance is attributed to the influence of Ag3Sn on the corrosion current.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
