采用TC4合金对Cf/Al复合材料超声焊接接头进行强化，形成TiAl3与碳纤维协同增强结构

IF 4.8 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2025-04-18 DOI:10.1016/j.matchar.2025.115070

Yang Xu , Qiangang Fu , Xiaoli Fan

{"title":"采用TC4合金对Cf/Al复合材料超声焊接接头进行强化，形成TiAl3与碳纤维协同增强结构","authors":"Yang Xu , Qiangang Fu , Xiaoli Fan","doi":"10.1016/j.matchar.2025.115070","DOIUrl":null,"url":null,"abstract":"<div><div>In this work, carbon fiber reinforced aluminum matrix composite (C<sub>f</sub>/Al) and TC4 alloy were joined by ultrasonic soldering using ZnAl solder. To reduce the soldering temperature, TC4 alloy was initially hot-dipped in molten pure Al with ultrasonic assistance. Results show that a TiAl<sub>3</sub> particle-reinforced Al layer, 80 μm thick, forms on the TC4 surface after 10 s of ultrasonication and 30 min of holding. During soldering, the Al matrix of both the C<sub>f</sub>/Al and the TiAl<sub>3</sub> reinforced layer dissolves, exposing the carbon fibers and TiAl<sub>3</sub> particles. These particles and fibers then migrate into the joint under the influence of acoustic vibration and solder squeezing. A fully reinforced joint, synergistically strengthened by both carbon fibers and TiAl<sub>3</sub> particles, is achieved using an ultrasonic power of 1000 W and an ultrasonication time of 12 s. This joint exhibits a shear strength of 30.2 MPa, comparable to the C<sub>f</sub>/Al substrate.</div></div>","PeriodicalId":18727,"journal":{"name":"Materials Characterization","volume":"224 ","pages":"Article 115070"},"PeriodicalIF":4.8000,"publicationDate":"2025-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Enhancing the ultrasonic soldered joint of Cf/Al composite with TC4 alloy by forming a TiAl3 and carbon fiber synergistically reinforcing structures\",\"authors\":\"Yang Xu , Qiangang Fu , Xiaoli Fan\",\"doi\":\"10.1016/j.matchar.2025.115070\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>In this work, carbon fiber reinforced aluminum matrix composite (C<sub>f</sub>/Al) and TC4 alloy were joined by ultrasonic soldering using ZnAl solder. To reduce the soldering temperature, TC4 alloy was initially hot-dipped in molten pure Al with ultrasonic assistance. Results show that a TiAl<sub>3</sub> particle-reinforced Al layer, 80 μm thick, forms on the TC4 surface after 10 s of ultrasonication and 30 min of holding. During soldering, the Al matrix of both the C<sub>f</sub>/Al and the TiAl<sub>3</sub> reinforced layer dissolves, exposing the carbon fibers and TiAl<sub>3</sub> particles. These particles and fibers then migrate into the joint under the influence of acoustic vibration and solder squeezing. A fully reinforced joint, synergistically strengthened by both carbon fibers and TiAl<sub>3</sub> particles, is achieved using an ultrasonic power of 1000 W and an ultrasonication time of 12 s. This joint exhibits a shear strength of 30.2 MPa, comparable to the C<sub>f</sub>/Al substrate.</div></div>\",\"PeriodicalId\":18727,\"journal\":{\"name\":\"Materials Characterization\",\"volume\":\"224 \",\"pages\":\"Article 115070\"},\"PeriodicalIF\":4.8000,\"publicationDate\":\"2025-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Characterization\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1044580325003596\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CHARACTERIZATION & TESTING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Characterization","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1044580325003596","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}

引用次数: 0

摘要

采用ZnAl焊料将碳纤维增强铝基复合材料（Cf/Al）与TC4合金进行超声波焊接。为了降低焊接温度，TC4合金首先在超声波辅助下热浸在熔融纯铝中。结果表明：超声处理10 s，保温30 min后，TC4表面形成了一层厚度为80 μm的TiAl3颗粒增强Al层；在焊接过程中，Cf/Al和TiAl3增强层的Al基体都溶解，暴露出碳纤维和TiAl3颗粒。这些颗粒和纤维在声波振动和焊料挤压的影响下迁移到接头中。在超声功率为1000 W、超声时间为12 s的情况下，碳纤维和TiAl3颗粒协同增强，获得了完全增强的接头。该接头的抗剪强度为30.2 MPa，与Cf/Al基体相当。

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Enhancing the ultrasonic soldered joint of Cf/Al composite with TC4 alloy by forming a TiAl3 and carbon fiber synergistically reinforcing structures

In this work, carbon fiber reinforced aluminum matrix composite (C_f/Al) and TC4 alloy were joined by ultrasonic soldering using ZnAl solder. To reduce the soldering temperature, TC4 alloy was initially hot-dipped in molten pure Al with ultrasonic assistance. Results show that a TiAl₃ particle-reinforced Al layer, 80 μm thick, forms on the TC4 surface after 10 s of ultrasonication and 30 min of holding. During soldering, the Al matrix of both the C_f/Al and the TiAl₃ reinforced layer dissolves, exposing the carbon fibers and TiAl₃ particles. These particles and fibers then migrate into the joint under the influence of acoustic vibration and solder squeezing. A fully reinforced joint, synergistically strengthened by both carbon fibers and TiAl₃ particles, is achieved using an ultrasonic power of 1000 W and an ultrasonication time of 12 s. This joint exhibits a shear strength of 30.2 MPa, comparable to the C_f/Al substrate.

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.