An Underwater Robust-Adhesion Triboelectric Ion-Gel Enabled by Amphiphilic Copolymer Encapsulation and Water-Induced Interfacial Rearrangement

Water drives the electronic device adhesion interface to debonding, leading to attenuation or distortion of signals and limiting the potential for underwater applications. Here, a hydrophobic ion-gel (HIG) modeled on barnacle gum was developed by encapsulating the ionic liquid [BMIm]Cl in a copolymer formed by free radical quenching of a lignin–carbohydrate complex (LCC) and polythioctic acid (PTA). Due to the dynamic bonding and hydrophobic action to promote the strong underwater adhesion, and a hydrophobic lining hydration structure that improves the underwater stability, the resulting HIG exhibits superextensibility (maximum 10,286%), stable underwater conductivity (180 mS m^–1), strong underwater adhesion (maximum 15 N/cm²), and rapid underwater self-healing. It can be used as a single-electrode triboelectric sensor without the need for additional adhesives and encapsulation design and simply adheres to the glove, enabling durable sensing and communication under water. The proposed strategy offers a novel possibility for the material design of flexible and wearable underwater electronics.