电聚合噻吩薄膜的电导率:熔融环噻吩作为单体的影响

IF 8.3 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Ganlin Liu, Xiangyu Zhang, Bohan Wang, Xinyu Wang, Haichao Liu, Cheng Zhou, Bing Yang, Liang Yao, Yuguang Ma
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引用次数: 0

摘要

聚噻吩及其衍生物由于其可调的电导率和易于通过电聚合合成而成为下一代电子应用的有希望的候选者。虽然熔合环噻吩单体在制造具有增强电子性能的多噻吩薄膜方面引起了相当大的兴趣,但是比较它们的电导率和阐明熔合环基序的结构影响的系统研究仍然有限。在这项研究中,我们探索了各种熔合环噻吩单体的电聚合行为,并通过原位电化学电导测量系统地评估了它们的电导率。通过核无关化学位移(NICS)和多中心键指数(MCBI)分析对单体芳构性的理论计算,我们的研究结果表明,融合噻吩环的不均匀芳构性在决定聚噻吩薄膜的电导率方面起着关键作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Conductivity of Electropolymerized Thiophene Films: Effect of Fused-Ring Thiophenes as the Monomer

Conductivity of Electropolymerized Thiophene Films: Effect of Fused-Ring Thiophenes as the Monomer
Polythiophene and its derivatives have emerged as promising candidates for next-generation electronic applications due to their tunable conductivity and ease of synthesis via electropolymerization. Although fused-ring thiophene monomers have attracted considerable interest for the fabrication of polythiophene films with enhanced electronic properties, systematic investigations comparing their conductivities and elucidating the structural influence of fused-ring motifs remain limited. In this study, we explore the electropolymerization behavior of various fused-ring thiophene monomers and systematically evaluate their conductivities through in situ electrochemical conductance measurements. Complemented by theoretical calculations of monomer aromaticity using nucleus-independent chemical shift (NICS) and multicenter bond index (MCBI) analyses, our findings reveal that the inhomogeneous aromaticity of fused thiophene rings plays a pivotal role in determining the conductivity of the resulting polythiophene films.
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来源期刊
ACS Applied Materials & Interfaces
ACS Applied Materials & Interfaces 工程技术-材料科学:综合
CiteScore
16.00
自引率
6.30%
发文量
4978
审稿时长
1.8 months
期刊介绍: ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.
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